Tempress S4T4 - TEOS 4"

Tempress S4T4 - TEOS 4"
Equipment Details
Technology	LPCVD
Materials Restriction	CMOS Clean
Sample Size	100mm
Gases Used	N2, Tetraethyl Silicate
Equipment Manual
Overview	System Overview
Operating Procedure	SOP
Supported Processes	TEOS
Maintenance	Maintenance

The Tempress diffusion system is a modular horizontal furnace designed to process silicon wafers as part of the manufacturing technology of semiconductor, optical, MEMS, and solar devices. TEOS (tetraeythlorthosilicate) is formed by using a process called LPCVD, Low Pressure Chemical Vapor Deposition. Chemical vapor deposition forms thin films on the surface of a substrate by thermal decomposition and/or reaction of gaseous compounds. The desired material is deposited directly from the gas phase onto the surface of the wafer. The important factors are gas ratio, temperature, and pressure. TEOS is a very conformal oxide that is used to fill high aspect ratio trenches, and gaps.

Announcements

• No announcements at this time.

Capabilities

• TEOS
• Maximum Thickness - 1.5µm

System overview

Hardware details

• N₂ - Maximum flow 10 slpm
• Tetraethyl Silicate - Maximum flow 200 sccm

Substrate requirements

• Silicon only
• Can process up to 25, 100 mm (4") wafers
• Wafer thickness, ~525um for 100mm (4")

All samples must go through the RCA Pre-Furnace clean procedure before being processed in the furnace

Material restrictions

The Tempress S4T4 - TEOS 4" is designated as a CMOS Clean class tool. Below is a list of approved materials for the tool. Approved means the material is allowed in the tool under normal circumstances. If a material is not listed, please create a helpdesk ticket or email info@lnf.umich.edu for any material requests or questions.

Supported processes

• TEOS
• Trench refill

Process details

• Process recipe overview

Characterization data

• TEOS

Standard operating procedure

• Quick reference SOP
• Detailed SOP

Checkout procedure

1. Create a Help desk Ticket requesting training.
2. A process engineer will schedule a time for initial training. After completing training the user can attempt a checkout session. It may be necessary for some users to participate in more than one training session, prior to attempting check out.
3. Schedule a checkout session with a tool engineer via the Help desk Ticket system. If this checkout is successful, the engineer will authorize you on the tool.

Maintenance

• Replace quartz boat, and dummy wafers when needed.
• Tube is replaced at 100µm of accumulated deposition.