Tempress S5T1 - Phosphorous Diffusion

Tempress S5T1 - Phosphorous Diffusion
Equipment Details
Technology	Thermal processing
Materials Restriction	CMOS Clean
Sample Size	100mm and/or 150mm
Chemicals Used	POCL3
Gases Used	N2, O2
Equipment Manual
Overview	System overview
Operating Procedure	SOP
Supported Processes	Phosphorous diffusion
Maintenance	Maintenance

The Tempress diffusion system is a modular horizontal furnace designed to process silicon wafers as part of the manufacturing technology of semiconductor, optical, MEMS, and solar devices. Diffusion refers to the process of intentionally introducing impurities into an extremely pure semiconductor in order to change its electrical properties. The diffusion process begins with the deposition of a high concentration of the desired impurity on the silicon surface. At high temperature the impurity atoms move, from the surface, further into the silicon crystal.

Announcements

• No announcements at this time.

Capabilities

• Phosphorous Diffusion

System overview

Hardware details

• N₂ - Maximum flow 20 slpm
• N₂ - Maximum flow 10 slpm
• N₂ - Maximum flow 1000 sccm
• O₂ - Maximum flow 1 slpm
• POCL₃

Substrate requirements

• Silicon only
• Can process up to 25, 100mm (4"), and or, 150mm (6") wafers
• Wafer thickness, 525um for 100mm (4"), and 675um for 150mm (6")

All samples must go through the RCA Pre-Furnace clean procedure before being processed in the furnace

Material restrictions

The Tempress S5T1 - Phosphorous Diffusion is designated as a CMOS Clean class tool. Below is a list of approved materials for the tool. Approved means the material is allowed in the tool under normal circumstances. If a material is not listed, please create a helpdesk ticket or email info@lnf.umich.edu for any material requests or questions.

Approved materials

Supported processes

• Phosphorous Diffusion

Process details

• Process recipe overview

Characterization data

• 15m POCL3 vs Temperature

Standard operating procedure

• Quick reference SOP

Checkout procedure

1. Create a Help desk Ticket requesting training.
2. A process engineer will schedule a time for initial training. After completing training the user can attempt a checkout session. It may be necessary for some users to participate in more than one training session, prior to attempting check out.
3. Schedule a checkout session with a tool engineer via the Help desk Ticket system. If this checkout is successful, the engineer will authorize you on the tool.

Maintenance

• Preventive maintenance for this tool is not necessary. We just fix it when it breaks