Tempress S6T3 - Flat Poly-Si 4"

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Tempress S6T3 - Flat Poly-Si 4"
Equipment Details
Technology LPCVD
Materials Restriction Metals
Sample Size 100mm
Gases Used N2, SiH4
Equipment Manual
Overview System Overview
Operating Procedure SOP
Supported Processes Polysilicon, Annealed polysilicon, Amorphous silicon
Maintenance Maintenance

The Tempress diffusion system is a modular horizontal furnace designed to process silicon wafers as part of the manufacturing technology of semiconductor, optical, MEMS, and solar devices. Polysilicon, Low Stress Poly-Si, and Amorphous silicon are formed by using a process called LPCVD, Low Pressure Chemical Vapor Deposition. Chemical vapor deposition forms thin films on the surface of a substrate by thermal decomposition and/or reaction of gaseous compounds. The desired material is deposited directly from the gas phase onto the surface of the wafer. The important factors are gas ratio, temperature, and pressure.


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System overview

Hardware details

  • N2 - Maximum flow 10 slpm
  • SiH4 - Maximum flow 300 sccm

Substrate requirements

  • Silicon only
  • Can process up to 25, 100 mm (4") wafers
  • Wafer thickness, ~525um for 100mm (4")
  • A solvent clean must be performed on any samples prior to the run
    • 5 min clean Acetone
    • 5 min clean IPA
    • 5 min fresh clean Acetone
    • 5 min fresh clean IPA
    • 3 min DI rinse

Material restrictions

The Tempress S6T3 - Flat Poly-Si 4" is designated as a Metals class tool. Below is a list of approved materials for the tool. Approved means the material is allowed in the tool under normal circumstances. If a material is not listed, please create a helpdesk ticket or email info@lnf.umich.edu for any material requests or questions.

Supported processes

Process details

Characterization data

Standard operating procedure

Checkout procedure

  1. Create a Help desk Ticket requesting training.
  2. A process engineer will schedule a time for initial training. After completing training the user can attempt a checkout session. It may be necessary for some users to participate in more than one training session, prior to attempting check out.
  3. Schedule a checkout session with a tool engineer via the Help desk Ticket system. If this checkout is successful, the engineer will authorize you on the tool.


  • Boats, and dummy wafers are replaced every 20-30µm of accumulated deposition.
  • Tube is replaced at 100µm of accumulated deposition.