Wire Bonder/Processes
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This page lists the processes supported by the LNF for the Wire Bonder.
Process List
The suggested starting parameters for bonding various materials are shown below. If you want to try bonding something else, we will have to characterize the bonding parameters.
| Metal System | Wire Dia. | Work Holder temp. | Wedge Heater setting | 1st Bond | 2nd Bond | |||||
|---|---|---|---|---|---|---|---|---|---|---|
| Wire | Bond Pad | Force | Time | Power | Force | Time | Power | |||
| Al | Al | .001" | Ambient | Off | 3 | 3 | 2.5 | 3 | 3 | 2.5 |
| Al | Cu | .001" | Ambient | Off | 6 | 6 | 9 | 6 | 6 | 9 |
| Al | Pt | .001" | Ambient | Off | 4 | 4 | 4 | 4 | 4 | 4 |
| Au | Pt | .001" | 160°C | 36 | 4.5 | 4.5 | 4.5 | 4.5 | 4.5 | 4.5 |
| Al | Au | .001" | Ambient | Off | 2.4 | 2.8 | 2.8 | 3.2 | 3.7 | 3 |
| Au | Au | .0007" | 150°C | 36 | 3 | 3 | 0 | 3 | 3 | 0 |
| Au | Au | .001" | Ambient | Off | 4 | 4 | 4 | 4 | 4 | 4 |
| Au | Rough Au | .0007" | 150°C | 36 | 4.5 | 4.5 | 4.5 | 4.5 | 4.5 | 4.5 |
| Al | Al | .0007" | Ambient | Off | 1.14 | 1.3 | 1.3 | 2.3 | 2.3 | 1.24 |
| Au | Ag | .001" | Ambient | Off | 5 | 5 | 4 | 5 | 5 | 4 |
