Xenon difluoride etching
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Xenon difluoride etching is a process that uses XeF2 to etch specific materials. It is a highly selective etch, as it spontaneously reacts at low pressures (3-5 Torr) with silicon, germanium, and molybdenum but is not reactive with other materials. It is often used as a release process.
Main article: Xactix XeF2
The LNF has one XeF2 etcher, the Xactix Xetch X.3.B.