Difference between revisions of "ACS 200 cluster tool"

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{{infobox equipment
 
{{infobox equipment
 
|caption =  
 
|caption =  
|materials = [[SPR 220]], [[SPR 955 0.9]], and LNF approved photo resist syringes
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|materials = [[SPR 220]], [[SPR 955|SPR 955 0.9]], and LNF approved photo resist syringes
 
|mask =
 
|mask =
 
|size =
 
|size =
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|gases =  
 
|gases =  
 
|overview = [[{{PAGENAME}}#System_overview | System Overview]]
 
|overview = [[{{PAGENAME}}#System_overview | System Overview]]
|sop = [https://docs.google.com/document/d/1kllBPlE3rimkcrjkLlaJyoa6BYINkp_9fhNZmkDhR3k/preview SOP]
 
 
|processes = [[{{PAGENAME}}/Processes|Supported Processes]]
 
|processes = [[{{PAGENAME}}/Processes|Supported Processes]]
 
|userprocesses = [[LNF_User:{{PAGENAME}}_user_processes|User Processes]]
 
|userprocesses = [[LNF_User:{{PAGENAME}}_user_processes|User Processes]]
 
|maintenance = [[{{PAGENAME}}#Maintenance | Maintenance]]
 
|maintenance = [[{{PAGENAME}}#Maintenance | Maintenance]]
 
}}
 
}}
 
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The [[{{PAGENAME}}]] is an automated [[photoresist]] [[Lithography|coating, baking, vapor prime, stripping and developing]] tool.  It can run full 4" and 6" cassettes of up to 25 wafers at a time.  It's capable of having multiple paths running simultaneously (ie., coating and developing from two different cassettes).  It automatically pumps [[SPR 220]]-(3.0) and [[SPR 955]] photoresists.  Other resists can be set up to automatically dispense from a syringe.  The spinner's closed lid option can help aid with more uniform sidewall coating.  [[HMDS]] is applied via vapor prime.  Both developers are CMOS compatible ([[MF 319]], and [[MF 300]]).  The developer temperature is controlled to within 0.1°C throughout the process.
 
 
The [[{{PAGENAME}}]] is an automated [[photoresist]] [[Lithography|coating, baking, vapor prime, stripping and developing]] tool.  It can run full 4" and 6" cassettes of up to 25 wafers at a time.  It's capable of having multiple paths running simultaneously (ie., coating and developing from two different cassettes).  It automatically pumps [[SPR 220]]-(3.0) and [[955]] photoresists.  Other resists can be set up to automatically dispense from a syringe.  The spinner's closed lid option can help aid with more uniform sidewall coating.  [[HMDS]] is applied via vapor prime.  Both developers are CMOS compatible ([[MF 319]], and [[MF 300]]).  The developer temperature is controlled to within 0.1°C throughout the process.
 
 
 
==Announcements==
 
*Currently the developer module is down on the ACS. The parts have been back ordered and are suppose to arrive at latest Thursday February 14th. Please create a ticket if you have a time sensitive project.
 
  
 
==Capabilities==
 
==Capabilities==
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===Hardware details===
 
===Hardware details===
 
* RC-8 spin coater with gyrset closed cover option
 
* RC-8 spin coater with gyrset closed cover option
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* Spinner equipped with back side rinse arm for 4" wafers only
 
* 4" chuck will accommodate 6"
 
* 4" chuck will accommodate 6"
* [[SPR 220]]-(3.0) and [[SPR 955 0.9]] photo resists automatically dispensed.
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* [[SPR 220]]-(3.0) and [[SPR 955|SPR 955 0.9]] photo resists automatically dispensed.
 
* All other approved resists can be coated with EFD dispense option.
 
* All other approved resists can be coated with EFD dispense option.
 
* Spray develop module fitted with [[MF 300]] and [[MF 319]]
 
* Spray develop module fitted with [[MF 300]] and [[MF 319]]
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<!-- We recommend creating a subpage detailing the supported processes for the tool, which will be generated if you leave the link below. Alternatively, you may include the information on this page. In that case, the Supported Processes document from the equipment manual can be included here, using {{#widget:GoogleDoc|key=googledocid}} -->
 
<!-- We recommend creating a subpage detailing the supported processes for the tool, which will be generated if you leave the link below. Alternatively, you may include the information on this page. In that case, the Supported Processes document from the equipment manual can be included here, using {{#widget:GoogleDoc|key=googledocid}} -->
  
There are several processes for this tool supported by the LNF, which are described in more detail on the [[/Processes/]] page.
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There are several processes for this tool supported by the LNF, which are described in more detail on the [[SPR 220]] and [[SPR 955]] pages.
 +
The tool is already equipped with various recipes for spin coating at different thicknesses, developing at different times and baking at different temperatures. If the tool is not equipped with a recipe that you need, then please create a helpdesk ticket.  
  
 
<!-- If you allow custom recipes, let users know to contact a tool engineer, and you may also create the link below which will create a page that users can add custom recipes to. -->
 
<!-- If you allow custom recipes, let users know to contact a tool engineer, and you may also create the link below which will create a page that users can add custom recipes to. -->
In addition to these, users can create a helpdesk ticket requesting a modification of one of the standard recipes by a tool engnineer. Some of these recipes are documented on [[LNF User:{{BASEPAGENAME}} User Processes|{{BASEPAGENAME}} user processes]].
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<!-- In addition to these, users can create a helpdesk ticket requesting a modification of one of the standard recipes by a tool engineer. Some of these recipes are documented on [[LNF User:{{BASEPAGENAME}} User Processes|{{BASEPAGENAME}} user processes]]. -->
  
 
==Standard operating procedure==
 
==Standard operating procedure==
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==Checkout procedure==
 
==Checkout procedure==
<!-- Describe the checkout procedure for the tool. For example: -->
 
# Read through this page and the [https://docs.google.com/document/d/1RQcdT_-BOGDHwU4Rf_C-xUL0lbHUDFxQaYZis66-n5k/preview Standard Operating Procedure] above.
 
# Practice with your mentor or another authorized user until you are comfortable with tool operation.
 
# Complete the SOP quiz [https://docs.google.com/forms/d/e/1FAIpQLSfDiKTeBkBx8wwwaLxeUDrVo99xP-wx31jRiDMqa72EP9BfaQ/viewform?usp=sf_link here]
 
# Create a [http://ssel-sched.eecs.umich.edu/sselScheduler/ResourceContact.aspx?tabindex=3&path=0:0:0:{{#var:toolid}} Helpdesk Ticket] requesting training/checkout.
 
# A tool engineer will schedule a time for training/checkout
 
  
==Maintenance==
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# Complete a [[Lithography training session]]. If you have already completed this for another tool, you do not need to complete it again.
Complete spinner clean and conditioning are done semi annually or as needed.
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# Practice on the tool with your mentor.
Fluid and resist fills are done/checked weekly.
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# Read through the User Manual above.
Hot plate ovens checked bi weekly and cleaned as needed.
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# Accurately complete the [https://docs.google.com/forms/d/e/1FAIpQLSfDiKTeBkBx8wwwaLxeUDrVo99xP-wx31jRiDMqa72EP9BfaQ/viewform?usp=sf_link checkout quiz]. You may retake as necessary until all answers are correct.
Spray develop checked weekly and maintained as needed.
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# Schedule a time for a checkout:
Robot training performed annually or as needed.
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## Find an available time for checkout [https://calendly.com/lnf-lithography/acs-checkout here].
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## Verify that the tool is available in the [https://ssel-sched.eecs.umich.edu/sselscheduler/ResourceDayWeek.aspx?Path=0-0-0-{{#var:toolid}} LNF Online Services] at the time you are requesting.
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## After confirmation that the event is scheduled in Calendly, invite the staff member assigned to your event to a Staff Support reservation at that time.
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# Create a [http://ssel-sched.eecs.umich.edu/sselScheduler/ResourceContact.aspx?tabindex=3&path=0:0:0:{{#var:toolid}} helpdesk ticket] for final confirmation of your checkout appointment.
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# Authorization will be provided pending demonstration of proper tool use in the presence of a tool engineer.

Revision as of 16:40, 7 September 2021

ACS 200 cluster tool
54040.jpg
Equipment Details
Technology Lithography
Materials Restriction Semi-Clean
Material Processed SPR 220, SPR 955 0.9, and LNF approved photo resist syringes
Chemicals Used MF 300, MF 319, EBR, Acetone, HMDS
Equipment Manual
Overview System Overview
Supported Processes Supported Processes
User Processes User Processes
Maintenance Maintenance


The ACS 200 cluster tool is an automated photoresist coating, baking, vapor prime, stripping and developing tool. It can run full 4" and 6" cassettes of up to 25 wafers at a time. It's capable of having multiple paths running simultaneously (ie., coating and developing from two different cassettes). It automatically pumps SPR 220-(3.0) and SPR 955 photoresists. Other resists can be set up to automatically dispense from a syringe. The spinner's closed lid option can help aid with more uniform sidewall coating. HMDS is applied via vapor prime. Both developers are CMOS compatible (MF 319, and MF 300). The developer temperature is controlled to within 0.1°C throughout the process.

Capabilities

  • Automated spin coating
  • Automated spray developing
  • Automated vapor prime
  • Photoresist stripping
  • 4" and 6" wafers
PMMA and other e-beam resists should be processed in Photoresist Bench 31 in 1480A
Any other non standard photoresist must have direct approval of tool owner
SU-8 may only be processed in the ROBIN lab

System overview

Hardware details

  • RC-8 spin coater with gyrset closed cover option
  • Spinner equipped with back side rinse arm for 4" wafers only
  • 4" chuck will accommodate 6"
  • SPR 220-(3.0) and SPR 955 0.9 photo resists automatically dispensed.
  • All other approved resists can be coated with EFD dispense option.
  • Spray develop module fitted with MF 300 and MF 319
  • Hot plate ovens and HMDS vapor prime chamber
  • Fully automated robot handling

Substrate requirements

  • 4" and 6" wafers
  • Glass wafers not preferred for baking

Material restrictions

The ACS 200 cluster tool is designated as a Semi-Clean class tool. Below is a list of approved materials for the tool. Approved means the material is allowed in the tool under normal circumstances. If a material is not listed, please create a helpdesk ticket or email info@lnf.umich.edu for any material requests or questions.


Supported processes

There are several processes for this tool supported by the LNF, which are described in more detail on the SPR 220 and SPR 955 pages. The tool is already equipped with various recipes for spin coating at different thicknesses, developing at different times and baking at different temperatures. If the tool is not equipped with a recipe that you need, then please create a helpdesk ticket.


Standard operating procedure

Widget text will go here.

Checkout procedure

  1. Complete a Lithography training session. If you have already completed this for another tool, you do not need to complete it again.
  2. Practice on the tool with your mentor.
  3. Read through the User Manual above.
  4. Accurately complete the checkout quiz. You may retake as necessary until all answers are correct.
  5. Schedule a time for a checkout:
    1. Find an available time for checkout here.
    2. Verify that the tool is available in the LNF Online Services at the time you are requesting.
    3. After confirmation that the event is scheduled in Calendly, invite the staff member assigned to your event to a Staff Support reservation at that time.
  6. Create a helpdesk ticket for final confirmation of your checkout appointment.
  7. Authorization will be provided pending demonstration of proper tool use in the presence of a tool engineer.