Difference between revisions of "ACS 200 cluster tool"

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--> {{#vardefine:toolid|54040}} <!--  
 
--> {{#vardefine:toolid|54040}} <!--  
 
Set the Process Technology (see subcategories on Equipment page)  
 
Set the Process Technology (see subcategories on Equipment page)  
--> {{#vardefine:technology|Lithography spin coating/developing}} <!--
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--> {{#vardefine:technology|Lithography}} <!--
 
Set the Material Restriction Level: 1 = CMOS Clean, 2 = Semi-Clean, 3 = Metals  
 
Set the Material Restriction Level: 1 = CMOS Clean, 2 = Semi-Clean, 3 = Metals  
--> {{#vardefine:restriction|3}}
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--> {{#vardefine:restriction|2}}
 
{{infobox equipment
 
{{infobox equipment
 
|caption =  
 
|caption =  
|materials =  
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|materials = [[SPR 220]], [[SPR 955|SPR 955 0.9]], and LNF approved photo resist syringes
 
|mask =
 
|mask =
 
|size =
 
|size =
|chemicals =
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|chemicals = [[MF 300]], [[MF 319]], [[EBR]], [[Acetone]], [[HMDS]]
 
|gases =  
 
|gases =  
 
|overview = [[{{PAGENAME}}#System_overview | System Overview]]
 
|overview = [[{{PAGENAME}}#System_overview | System Overview]]
|sop = [https://link.to.google.doc/preview SOP]
 
 
|processes = [[{{PAGENAME}}/Processes|Supported Processes]]
 
|processes = [[{{PAGENAME}}/Processes|Supported Processes]]
 
|userprocesses = [[LNF_User:{{PAGENAME}}_user_processes|User Processes]]
 
|userprocesses = [[LNF_User:{{PAGENAME}}_user_processes|User Processes]]
 
|maintenance = [[{{PAGENAME}}#Maintenance | Maintenance]]
 
|maintenance = [[{{PAGENAME}}#Maintenance | Maintenance]]
 
}}
 
}}
 
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The [[{{PAGENAME}}]] is an automated [[photoresist]] [[Lithography|coating, baking, vapor prime, stripping and developing]] tool.  It can run full 4" and 6" cassettes of up to 25 wafers at a time.  It's capable of having multiple paths running simultaneously (ie., coating and developing from two different cassettes).  It automatically pumps [[SPR 220]]-(3.0) and [[SPR 955]] photoresists.  Other resists can be set up to automatically dispense from a syringe.  The spinner's closed lid option can help aid with more uniform sidewall coating.  [[HMDS]] is applied via vapor prime.  Both developers are CMOS compatible ([[MF 319]], and [[MF 300]]).  The developer temperature is controlled to within 0.1°C throughout the process.
{{warning|This page has not been released yet.}}
 
 
 
<!-- Insert the tool description here -->
 
 
 
==Announcements==
 
*Update this with announcements as necessary
 
  
 
==Capabilities==
 
==Capabilities==
 
<!--A more general description of what the tool is capable of doing.-->
 
<!--A more general description of what the tool is capable of doing.-->
* Resolution
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* Automated spin coating
* Aspect Ratio
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* Automated spray developing
* Thickness range
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* Automated vapor prime
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* Photoresist stripping
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* 4" and 6" wafers
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{{note|[[PMMA]] and other e-beam resists should be processed in [[Photoresist Bench 31]] in 1480A|reminder}}
 +
{{note|Any other non standard photoresist must have direct approval of tool owner|reminder}}
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{{note|[[SU-8]] may only be processed in the [[ROBIN]] lab|error}}
  
 
==System overview==
 
==System overview==
 
===Hardware details===
 
===Hardware details===
* Gases
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* RC-8 spin coater with gyrset closed cover option
* Pressure
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* Spinner equipped with back side rinse arm for 4" wafers only
* Chuck
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* 4" chuck will accommodate 6"
* Chamber
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* [[SPR 220]]-(3.0) and [[SPR 955|SPR 955 0.9]] photo resists automatically dispensed.
* RF / Power Specs
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* All other approved resists can be coated with EFD dispense option.
* Chemicals
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* Spray develop module fitted with [[MF 300]] and [[MF 319]]
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* Hot plate ovens and [[HMDS]] [[vapor prime]] chamber
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* Fully automated robot handling
  
 
===Substrate requirements===
 
===Substrate requirements===
* Wafer Size
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* 4" and 6" wafers
* Wafer type
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* Glass wafers not preferred for baking
* Any mounting?
 
* Wafer thickness
 
  
 
===Material restrictions===
 
===Material restrictions===
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<!-- We recommend creating a subpage detailing the supported processes for the tool, which will be generated if you leave the link below. Alternatively, you may include the information on this page. In that case, the Supported Processes document from the equipment manual can be included here, using {{#widget:GoogleDoc|key=googledocid}} -->
 
<!-- We recommend creating a subpage detailing the supported processes for the tool, which will be generated if you leave the link below. Alternatively, you may include the information on this page. In that case, the Supported Processes document from the equipment manual can be included here, using {{#widget:GoogleDoc|key=googledocid}} -->
  
There are several processes for this tool supported by the LNF, which are described in more detail on the [[/Processes/]] page.
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There are several processes for this tool supported by the LNF, which are described in more detail on the [[SPR 220]] and [[SPR 955]] pages.
 +
The tool is already equipped with various recipes for spin coating at different thicknesses, developing at different times and baking at different temperatures. If the tool is not equipped with a recipe that you need, then please create a helpdesk ticket.  
  
 
<!-- If you allow custom recipes, let users know to contact a tool engineer, and you may also create the link below which will create a page that users can add custom recipes to. -->
 
<!-- If you allow custom recipes, let users know to contact a tool engineer, and you may also create the link below which will create a page that users can add custom recipes to. -->
In addition to these, this tool has a number of user-created recipes for etching a wide variety of materials. Some of these recipes are documented on [[LNF User:{{BASEPAGENAME}} User Processes|{{BASEPAGENAME}} user processes]]. If you are curious if your material can be processed in this tool, please contact the tool engineers via the helpdesk ticket system.
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<!-- In addition to these, users can create a helpdesk ticket requesting a modification of one of the standard recipes by a tool engineer. Some of these recipes are documented on [[LNF User:{{BASEPAGENAME}} User Processes|{{BASEPAGENAME}} user processes]]. -->
  
 
==Standard operating procedure==
 
==Standard operating procedure==
 
<!-- To include a document from google docs, use the line below, replace "googledocid" with the ID for the document. Remember, to make this visible, you must set Sharing for the document to "Anyone with the link can view". -->
 
<!-- To include a document from google docs, use the line below, replace "googledocid" with the ID for the document. Remember, to make this visible, you must set Sharing for the document to "Anyone with the link can view". -->
{{#widget:GoogleDoc|key=googledocid}}
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{{#widget:GoogleDoc|key=1RQcdT_-BOGDHwU4Rf_C-xUL0lbHUDFxQaYZis66-n5k}}
  
 
==Checkout procedure==
 
==Checkout procedure==
<!-- Describe the checkout procedure for the tool. For example: -->
 
# Read through this page and the Standard Operating Procedure above.
 
# Complete the training request form [http://examplelink.com here].
 
# Create a [http://ssel-sched.eecs.umich.edu/sselScheduler/ResourceContact.aspx?tabindex=3&path=0:0:0:{{#var:toolid}} Helpdesk Ticket] requesting training.
 
# A tool engineer will schedule a time for initial training.
 
# Practice with your mentor or another authorized user until you are comfortable with tool operation.
 
# Complete the SOP quiz [http://examplelink.com here].
 
# Schedule a checkout session with a tool engineer via the helpdesk ticket system. If this checkout is successful, the engineer will authorize you on the tool.
 
  
==Maintenance==
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# Complete a [[Lithography training session]]. If you have already completed this for another tool, you do not need to complete it again.
<!-- Describe standard maintenance/qualification tests here -->
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# Practice on the tool with your mentor.
 
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# Read through the User Manual above.
===Process name===
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# Accurately complete the [https://docs.google.com/forms/d/e/1FAIpQLSfDiKTeBkBx8wwwaLxeUDrVo99xP-wx31jRiDMqa72EP9BfaQ/viewform?usp=sf_link checkout quiz]. You may retake as necessary until all answers are correct.
<!-- This is an example a chart published with etch data. You can just replace the url with your own. -->
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# Schedule a time for a checkout:
{{#widget:Iframe
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## Find an available time for checkout [https://calendly.com/lnf-lithography/acs-checkout here].
|url=chart url
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## Verify that the tool is available in the [https://ssel-sched.eecs.umich.edu/sselscheduler/ResourceDayWeek.aspx?Path=0-0-0-{{#var:toolid}} LNF Online Services] at the time you are requesting.
|width=800
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## After confirmation that the event is scheduled in Calendly, invite the staff member assigned to your event to a Staff Support reservation at that time.
|height=400
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# Create a [http://ssel-sched.eecs.umich.edu/sselScheduler/ResourceContact.aspx?tabindex=3&path=0:0:0:{{#var:toolid}} helpdesk ticket] for final confirmation of your checkout appointment.
|border=0
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# Authorization will be provided pending demonstration of proper tool use in the presence of a tool engineer.
}}
 

Revision as of 16:40, 7 September 2021

ACS 200 cluster tool
54040.jpg
Equipment Details
Technology Lithography
Materials Restriction Semi-Clean
Material Processed SPR 220, SPR 955 0.9, and LNF approved photo resist syringes
Chemicals Used MF 300, MF 319, EBR, Acetone, HMDS
Equipment Manual
Overview System Overview
Supported Processes Supported Processes
User Processes User Processes
Maintenance Maintenance


The ACS 200 cluster tool is an automated photoresist coating, baking, vapor prime, stripping and developing tool. It can run full 4" and 6" cassettes of up to 25 wafers at a time. It's capable of having multiple paths running simultaneously (ie., coating and developing from two different cassettes). It automatically pumps SPR 220-(3.0) and SPR 955 photoresists. Other resists can be set up to automatically dispense from a syringe. The spinner's closed lid option can help aid with more uniform sidewall coating. HMDS is applied via vapor prime. Both developers are CMOS compatible (MF 319, and MF 300). The developer temperature is controlled to within 0.1°C throughout the process.

Capabilities

  • Automated spin coating
  • Automated spray developing
  • Automated vapor prime
  • Photoresist stripping
  • 4" and 6" wafers
PMMA and other e-beam resists should be processed in Photoresist Bench 31 in 1480A
Any other non standard photoresist must have direct approval of tool owner
SU-8 may only be processed in the ROBIN lab

System overview

Hardware details

  • RC-8 spin coater with gyrset closed cover option
  • Spinner equipped with back side rinse arm for 4" wafers only
  • 4" chuck will accommodate 6"
  • SPR 220-(3.0) and SPR 955 0.9 photo resists automatically dispensed.
  • All other approved resists can be coated with EFD dispense option.
  • Spray develop module fitted with MF 300 and MF 319
  • Hot plate ovens and HMDS vapor prime chamber
  • Fully automated robot handling

Substrate requirements

  • 4" and 6" wafers
  • Glass wafers not preferred for baking

Material restrictions

The ACS 200 cluster tool is designated as a Semi-Clean class tool. Below is a list of approved materials for the tool. Approved means the material is allowed in the tool under normal circumstances. If a material is not listed, please create a helpdesk ticket or email info@lnf.umich.edu for any material requests or questions.


Supported processes

There are several processes for this tool supported by the LNF, which are described in more detail on the SPR 220 and SPR 955 pages. The tool is already equipped with various recipes for spin coating at different thicknesses, developing at different times and baking at different temperatures. If the tool is not equipped with a recipe that you need, then please create a helpdesk ticket.


Standard operating procedure

Widget text will go here.

Checkout procedure

  1. Complete a Lithography training session. If you have already completed this for another tool, you do not need to complete it again.
  2. Practice on the tool with your mentor.
  3. Read through the User Manual above.
  4. Accurately complete the checkout quiz. You may retake as necessary until all answers are correct.
  5. Schedule a time for a checkout:
    1. Find an available time for checkout here.
    2. Verify that the tool is available in the LNF Online Services at the time you are requesting.
    3. After confirmation that the event is scheduled in Calendly, invite the staff member assigned to your event to a Staff Support reservation at that time.
  6. Create a helpdesk ticket for final confirmation of your checkout appointment.
  7. Authorization will be provided pending demonstration of proper tool use in the presence of a tool engineer.