Difference between revisions of "ACS 200 cluster tool"
Jump to navigation
Jump to search
| (41 intermediate revisions by 5 users not shown) | |||
| Line 2: | Line 2: | ||
--> {{#vardefine:toolid|54040}} <!-- | --> {{#vardefine:toolid|54040}} <!-- | ||
Set the Process Technology (see subcategories on Equipment page) | Set the Process Technology (see subcategories on Equipment page) | ||
| − | --> {{#vardefine:technology|Lithography | + | --> {{#vardefine:technology|Lithography}} <!-- |
Set the Material Restriction Level: 1 = CMOS Clean, 2 = Semi-Clean, 3 = Metals | Set the Material Restriction Level: 1 = CMOS Clean, 2 = Semi-Clean, 3 = Metals | ||
--> {{#vardefine:restriction|2}} | --> {{#vardefine:restriction|2}} | ||
{{infobox equipment | {{infobox equipment | ||
|caption = | |caption = | ||
| − | |materials = | + | |materials = [[SPR 220]], [[SPR 955|SPR 955 0.9]], and LNF approved photo resist syringes |
|mask = | |mask = | ||
|size = | |size = | ||
| − | |chemicals = | + | |chemicals = [[MF 300]], [[MF 319]], [[EBR]], [[Acetone]], [[HMDS]] |
|gases = | |gases = | ||
|overview = [[{{PAGENAME}}#System_overview | System Overview]] | |overview = [[{{PAGENAME}}#System_overview | System Overview]] | ||
| − | |||
|processes = [[{{PAGENAME}}/Processes|Supported Processes]] | |processes = [[{{PAGENAME}}/Processes|Supported Processes]] | ||
|userprocesses = [[LNF_User:{{PAGENAME}}_user_processes|User Processes]] | |userprocesses = [[LNF_User:{{PAGENAME}}_user_processes|User Processes]] | ||
|maintenance = [[{{PAGENAME}}#Maintenance | Maintenance]] | |maintenance = [[{{PAGENAME}}#Maintenance | Maintenance]] | ||
}} | }} | ||
| − | + | The [[{{PAGENAME}}]] is an automated [[photoresist]] [[Lithography|coating, baking, vapor prime, stripping and developing]] tool. It can run full 4" and 6" cassettes of up to 25 wafers at a time. It's capable of having multiple paths running simultaneously (ie., coating and developing from two different cassettes). It automatically pumps [[SPR 220]]-(3.0) and [[SPR 955]] photoresists. Other resists can be set up to automatically dispense from a syringe. The spinner's closed lid option can help aid with more uniform sidewall coating. [[HMDS]] is applied via vapor prime. Both developers are CMOS compatible ([[MF 319]], and [[MF 300]]). The developer temperature is controlled to within 0.1°C throughout the process. | |
| − | {{ | ||
| − | |||
| − | |||
| − | |||
| − | |||
| − | |||
==Capabilities== | ==Capabilities== | ||
| Line 30: | Line 23: | ||
* Automated spin coating | * Automated spin coating | ||
* Automated spray developing | * Automated spray developing | ||
| + | * Automated vapor prime | ||
| + | * Photoresist stripping | ||
* 4" and 6" wafers | * 4" and 6" wafers | ||
{{note|[[PMMA]] and other e-beam resists should be processed in [[Photoresist Bench 31]] in 1480A|reminder}} | {{note|[[PMMA]] and other e-beam resists should be processed in [[Photoresist Bench 31]] in 1480A|reminder}} | ||
| Line 38: | Line 33: | ||
===Hardware details=== | ===Hardware details=== | ||
* RC-8 spin coater with gyrset closed cover option | * RC-8 spin coater with gyrset closed cover option | ||
| + | * Spinner equipped with back side rinse arm for 4" wafers only | ||
* 4" chuck will accommodate 6" | * 4" chuck will accommodate 6" | ||
| − | * | + | * [[SPR 220]]-(3.0) and [[SPR 955|SPR 955 0.9]] photo resists automatically dispensed. |
* All other approved resists can be coated with EFD dispense option. | * All other approved resists can be coated with EFD dispense option. | ||
| − | * Spray develop module fitted with | + | * Spray develop module fitted with [[MF 300]] and [[MF 319]] |
| − | * Hot plate ovens and HMDS vapor prime chamber | + | * Hot plate ovens and [[HMDS]] [[vapor prime]] chamber |
* Fully automated robot handling | * Fully automated robot handling | ||
===Substrate requirements=== | ===Substrate requirements=== | ||
* 4" and 6" wafers | * 4" and 6" wafers | ||
| − | * | + | * Glass wafers not preferred for baking |
===Material restrictions=== | ===Material restrictions=== | ||
| Line 55: | Line 51: | ||
<!-- We recommend creating a subpage detailing the supported processes for the tool, which will be generated if you leave the link below. Alternatively, you may include the information on this page. In that case, the Supported Processes document from the equipment manual can be included here, using {{#widget:GoogleDoc|key=googledocid}} --> | <!-- We recommend creating a subpage detailing the supported processes for the tool, which will be generated if you leave the link below. Alternatively, you may include the information on this page. In that case, the Supported Processes document from the equipment manual can be included here, using {{#widget:GoogleDoc|key=googledocid}} --> | ||
| − | There are several processes for this tool supported by the LNF, which are described in more detail on the [[ | + | There are several processes for this tool supported by the LNF, which are described in more detail on the [[SPR 220]] and [[SPR 955]] pages. |
| + | The tool is already equipped with various recipes for spin coating at different thicknesses, developing at different times and baking at different temperatures. If the tool is not equipped with a recipe that you need, then please create a helpdesk ticket. | ||
<!-- If you allow custom recipes, let users know to contact a tool engineer, and you may also create the link below which will create a page that users can add custom recipes to. --> | <!-- If you allow custom recipes, let users know to contact a tool engineer, and you may also create the link below which will create a page that users can add custom recipes to. --> | ||
| − | In addition to these, | + | <!-- In addition to these, users can create a helpdesk ticket requesting a modification of one of the standard recipes by a tool engineer. Some of these recipes are documented on [[LNF User:{{BASEPAGENAME}} User Processes|{{BASEPAGENAME}} user processes]]. --> |
==Standard operating procedure== | ==Standard operating procedure== | ||
<!-- To include a document from google docs, use the line below, replace "googledocid" with the ID for the document. Remember, to make this visible, you must set Sharing for the document to "Anyone with the link can view". --> | <!-- To include a document from google docs, use the line below, replace "googledocid" with the ID for the document. Remember, to make this visible, you must set Sharing for the document to "Anyone with the link can view". --> | ||
| − | {{#widget:GoogleDoc|key= | + | {{#widget:GoogleDoc|key=1RQcdT_-BOGDHwU4Rf_C-xUL0lbHUDFxQaYZis66-n5k}} |
==Checkout procedure== | ==Checkout procedure== | ||
| − | |||
| − | |||
| − | |||
| − | |||
| − | |||
| − | |||
| − | |||
| − | |||
| − | + | # Complete a [[Lithography training session]]. If you have already completed this for another tool, you do not need to complete it again. | |
| − | + | # Practice on the tool with your mentor. | |
| − | + | # Read through the User Manual above. | |
| − | + | # Accurately complete the [https://docs.google.com/forms/d/e/1FAIpQLSfDiKTeBkBx8wwwaLxeUDrVo99xP-wx31jRiDMqa72EP9BfaQ/viewform?usp=sf_link checkout quiz]. You may retake as necessary until all answers are correct. | |
| − | + | # Schedule a time for a checkout: | |
| − | {{# | + | ## Find an available time for checkout [https://calendly.com/lnf-lithography/acs-checkout here]. |
| − | + | ## Verify that the tool is available in the [https://ssel-sched.eecs.umich.edu/sselscheduler/ResourceDayWeek.aspx?Path=0-0-0-{{#var:toolid}} LNF Online Services] at the time you are requesting. | |
| − | + | ## After confirmation that the event is scheduled in Calendly, invite the staff member assigned to your event to a Staff Support reservation at that time. | |
| − | + | # Create a [http://ssel-sched.eecs.umich.edu/sselScheduler/ResourceContact.aspx?tabindex=3&path=0:0:0:{{#var:toolid}} helpdesk ticket] for final confirmation of your checkout appointment. | |
| − | + | # Authorization will be provided pending demonstration of proper tool use in the presence of a tool engineer. | |
| − | }} | ||
Revision as of 16:40, 7 September 2021
| ACS 200 cluster tool | |
|---|---|
 | |
| Equipment Details | |
| Technology | Lithography |
| Materials Restriction | Semi-Clean |
| Material Processed | SPR 220, SPR 955 0.9, and LNF approved photo resist syringes |
| Chemicals Used | MF 300, MF 319, EBR, Acetone, HMDS |
| Equipment Manual | |
| Overview | System Overview |
| Supported Processes | Supported Processes |
| User Processes | User Processes |
| Maintenance | Maintenance |
The ACS 200 cluster tool is an automated photoresist coating, baking, vapor prime, stripping and developing tool. It can run full 4" and 6" cassettes of up to 25 wafers at a time. It's capable of having multiple paths running simultaneously (ie., coating and developing from two different cassettes). It automatically pumps SPR 220-(3.0) and SPR 955 photoresists. Other resists can be set up to automatically dispense from a syringe. The spinner's closed lid option can help aid with more uniform sidewall coating. HMDS is applied via vapor prime. Both developers are CMOS compatible (MF 319, and MF 300). The developer temperature is controlled to within 0.1°C throughout the process.
Contents
Capabilities
- Automated spin coating
- Automated spray developing
- Automated vapor prime
- Photoresist stripping
- 4" and 6" wafers
PMMA and other e-beam resists should be processed in Photoresist Bench 31 in 1480A
Any other non standard photoresist must have direct approval of tool owner
System overview
Hardware details
- RC-8 spin coater with gyrset closed cover option
- Spinner equipped with back side rinse arm for 4" wafers only
- 4" chuck will accommodate 6"
- SPR 220-(3.0) and SPR 955 0.9 photo resists automatically dispensed.
- All other approved resists can be coated with EFD dispense option.
- Spray develop module fitted with MF 300 and MF 319
- Hot plate ovens and HMDS vapor prime chamber
- Fully automated robot handling
Substrate requirements
- 4" and 6" wafers
- Glass wafers not preferred for baking
Material restrictions
The ACS 200 cluster tool is designated as a Semi-Clean class tool. Below is a list of approved materials for the tool. Approved means the material is allowed in the tool under normal circumstances. If a material is not listed, please create a helpdesk ticket or email info@lnf.umich.edu for any material requests or questions.
Approved materials
Supported processes
There are several processes for this tool supported by the LNF, which are described in more detail on the SPR 220 and SPR 955 pages. The tool is already equipped with various recipes for spin coating at different thicknesses, developing at different times and baking at different temperatures. If the tool is not equipped with a recipe that you need, then please create a helpdesk ticket.
Standard operating procedure
Widget text will go here.
Checkout procedure
- Complete a Lithography training session. If you have already completed this for another tool, you do not need to complete it again.
- Practice on the tool with your mentor.
- Read through the User Manual above.
- Accurately complete the checkout quiz. You may retake as necessary until all answers are correct.
- Schedule a time for a checkout:
- Find an available time for checkout here.
- Verify that the tool is available in the LNF Online Services at the time you are requesting.
- After confirmation that the event is scheduled in Calendly, invite the staff member assigned to your event to a Staff Support reservation at that time.
- Create a helpdesk ticket for final confirmation of your checkout appointment.
- Authorization will be provided pending demonstration of proper tool use in the presence of a tool engineer.
