Difference between revisions of "ACS 200 cluster tool"
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| − | This tool is an Automated Photoresist coating, baking and developing tool. It can run full 4" and 6" cassettes of wafers at a time. It's capable of having multiple paths running simultaneously (ie., coating and developing from two different cassettes). It automatically pumps spr 220(3.0) and 1813 photoresists. Other resists can be set up to automatically dispense from a syringe. The spinner's closed lid option can help aid with more uniform sidewall coating. HMDS is applied via vapor prime. Both developers are CMOS compatible (MF319, and MF300). | + | This tool is an Automated Photoresist coating, baking and developing tool. It can run full 4" and 6" cassettes of wafers at a time. It's capable of having multiple paths running simultaneously (ie., coating and developing from two different cassettes). It automatically pumps spr 220(3.0) and 1813 photoresists. Other resists can be set up to automatically dispense from a syringe. The spinner's closed lid option can help aid with more uniform sidewall coating. HMDS is applied via vapor prime. Both developers are CMOS compatible (MF319, and MF300). The developer temperature is controlled to within 0.1 degrees C throughout the process. |
==Announcements== | ==Announcements== | ||
Revision as of 13:39, 24 August 2015
| ACS 200 cluster tool | |
|---|---|
 | |
| Equipment Details | |
| Technology | Lithography Automated spin coating/developing |
| Materials Restriction | Semi-Clean |
| Material Processed | spr 220, 1813, and LNF approved photo resist syringes |
| Chemicals Used | MF300, MF319, EBR |
| Equipment Manual | |
| Overview | System Overview |
| Operating Procedure | SOP |
| Supported Processes | Supported Processes |
| User Processes | User Processes |
| Maintenance | Maintenance |
 Warning: | This page has not been released yet. |
This tool is an Automated Photoresist coating, baking and developing tool. It can run full 4" and 6" cassettes of wafers at a time. It's capable of having multiple paths running simultaneously (ie., coating and developing from two different cassettes). It automatically pumps spr 220(3.0) and 1813 photoresists. Other resists can be set up to automatically dispense from a syringe. The spinner's closed lid option can help aid with more uniform sidewall coating. HMDS is applied via vapor prime. Both developers are CMOS compatible (MF319, and MF300). The developer temperature is controlled to within 0.1 degrees C throughout the process.
Contents
Announcements
- Update this with announcements as necessary
Capabilities
- Automated spin coating
- Automated spray developing
- 4" and 6" wafers
System overview
Hardware details
- RC-8 spin coater with gyrset closed cover option
- 4" chuck will accommodate 6"
- spr 220(3.0) and 1813 photo resists automatically dispensed.
- All other approved resists can be coated with EFD dispense option.
- Spray develop module fitted with MF300 and MF319
- Hot plate ovens and HMDS vapor prime chamber
- Fully automated robot handling
Substrate requirements
- 4" and 6" wafers
- glass wafers not preferred for baking
Material restrictions
The ACS 200 cluster tool is designated as a Semi-Clean class tool. Below is a list of approved materials for the tool. Approved means the material is allowed in the tool under normal circumstances. If a material is not listed, please create a helpdesk ticket or email info@lnf.umich.edu for any material requests or questions.
Supported processes
There are several processes for this tool supported by the LNF, which are described in more detail on the Processes page.
In addition to these, users can create a helpdesk ticket requesting a modification of one of the standard recipes by a tool engnineer. Some of these recipes are documented on ACS 200 cluster tool user processes.
Standard operating procedure
Widget text will go here.
Checkout procedure
- Read through this page and the Standard Operating Procedure above.
- Practice with your mentor or another authorized user until you are comfortable with tool operation.
- Create a Helpdesk Ticket requesting training/checkout.
- A tool engineer will schedule a time for training/checkout
Maintenance
Complete spinner clean and conditioning are done semi annually or as needed. Fluid and resist fills are done/checked weekly. Hot plate ovens checked bi weekly and cleaned as needed. Spray develop checked weekly and maintained as needed. Robot training performed annually or as needed.
Process name
