Difference between revisions of "ACS 200 cluster tool"

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<!-- If you allow custom recipes, let users know to contact a tool engineer, and you may also create the link below which will create a page that users can add custom recipes to. -->
 
<!-- If you allow custom recipes, let users know to contact a tool engineer, and you may also create the link below which will create a page that users can add custom recipes to. -->
In addition to these, this tool has a number of user-created recipes for etching a wide variety of materials. Some of these recipes are documented on [[LNF User:{{BASEPAGENAME}} User Processes|{{BASEPAGENAME}} user processes]]. If you are curious if your material can be processed in this tool, please contact the tool engineers via the helpdesk ticket system.
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In addition to these, users can create a helpdesk ticket requesting a modification of one of the standard recipes by a tool engnineer. Some of these recipes are documented on [[LNF User:{{BASEPAGENAME}} User Processes|{{BASEPAGENAME}} user processes]].
  
 
==Standard operating procedure==
 
==Standard operating procedure==

Revision as of 12:03, 24 August 2015

ACS 200 cluster tool
54040.jpg
Equipment Details
Technology Lithography spin coating/developing
Materials Restriction Semi-Clean
Material Processed spr 220, 1813, and LNF approved photo resist syringes
Chemicals Used MF300, MF319, EBR
Equipment Manual
Overview System Overview
Operating Procedure SOP
Supported Processes Supported Processes
User Processes User Processes
Maintenance Maintenance


Warning Warning: This page has not been released yet.


Announcements

  • Update this with announcements as necessary

Capabilities

  • Automated spin coating
  • Automated spray developing
  • 4" and 6" wafers
PMMA and other e-beam resists should be processed in Photoresist Bench 31 in 1480A
Any other non standard photoresist must have direct approval of tool owner
SU-8 may only be processed in the ROBIN lab

System overview

Hardware details

  • RC-8 spin coater with gyrset closed cover option
  • 4" chuck will accommodate 6"
  • spr 220(3.0) and 1813 photo resists automatically dispensed.
  • All other approved resists can be coated with EFD dispense option.
  • Spray develop module fitted with MF300 and MF319
  • Hot plate ovens and HMDS vapor prime chamber
  • Fully automated robot handling

Substrate requirements

  • 4" and 6" wafers
  • glass wafers not preferred for baking

Material restrictions

The ACS 200 cluster tool is designated as a Semi-Clean class tool. Below is a list of approved materials for the tool. Approved means the material is allowed in the tool under normal circumstances. If a material is not listed, please create a helpdesk ticket or email info@lnf.umich.edu for any material requests or questions.


Supported processes

There are several processes for this tool supported by the LNF, which are described in more detail on the Processes page.

In addition to these, users can create a helpdesk ticket requesting a modification of one of the standard recipes by a tool engnineer. Some of these recipes are documented on ACS 200 cluster tool user processes.

Standard operating procedure

Widget text will go here.

Checkout procedure

  1. Read through this page and the Standard Operating Procedure above.
  2. Practice with your mentor or another authorized user until you are comfortable with tool operation.
  3. Create a Helpdesk Ticket requesting training/checkout.
  4. A tool engineer will schedule a time for training/checkout

Maintenance

Complete spinner clean and conditioning are done semi annually or as needed. Fluid and resist fills are done/checked weekly. Hot plate ovens checked bi weekly and cleaned as needed. Spray develop checked weekly and maintained as needed. Robot training performed annually or as needed.

Process name