Difference between revisions of "ACS 200 cluster tool"

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Set the Material Restriction Level: 1 = CMOS Clean, 2 = Semi-Clean, 3 = Metals  
 
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{{infobox equipment
 
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|caption =  
 
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|materials = spr 220, 1813, and LNF approved photo resist syringes
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|materials = [[SPR 220]], [[1813]], and LNF approved photo resist syringes
 
|mask =
 
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|chemicals = MF300, MF319, EBR
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|chemicals = [[MF 300]], [[MF 319]], [[EBR]], [[Acetone]], [[HMDS]]
 
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|overview = [[{{PAGENAME}}#System_overview | System Overview]]
 
|overview = [[{{PAGENAME}}#System_overview | System Overview]]
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{{warning|This page has not been released yet.}}
 
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This tool is an Automated Photoresist coating, baking and developing tool.  It can run full 4" and 6" cassettes of wafers at a time.  It's capable of having multiple paths running simultaneously (ie., coating and developing from two different cassettes).  It automatically pumps spr 220(3.0) and 1813 photoresists.  Other resists can be set up to automatically dispense from a syringe.  The spinner's closed lid option can help aid with more uniform sidewall coating.  HMDS is applied via vapor prime.  Both developers are CMOS compatible (MF319, and MF300).  The developer temperature is controlled to within 0.1 degrees C throughout the process.
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The [[{{PAGENAME}}]] is an automated [[photoresist]] [[Lithography|coating, baking and developing]] tool.  It can run full 4" and 6" cassettes of wafers at a time.  It's capable of having multiple paths running simultaneously (ie., coating and developing from two different cassettes).  It automatically pumps [[SPR 220]]-(3.0) and [[1813]] photoresists.  Other resists can be set up to automatically dispense from a syringe.  The spinner's closed lid option can help aid with more uniform sidewall coating.  [[HMDS]] is applied via vapor prime.  Both developers are CMOS compatible ([[MF 319]], and [[MF 300]]).  The developer temperature is controlled to within 0.1°C throughout the process.
  
 
==Announcements==
 
==Announcements==
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* RC-8 spin coater with gyrset closed cover option
 
* RC-8 spin coater with gyrset closed cover option
 
* 4" chuck will accommodate 6"
 
* 4" chuck will accommodate 6"
* spr 220(3.0) and 1813 photo resists automatically dispensed.
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* [[SPR 220]]-(3.0) and [[1813]] photo resists automatically dispensed.
 
* All other approved resists can be coated with EFD dispense option.
 
* All other approved resists can be coated with EFD dispense option.
* Spray develop module fitted with MF300 and MF319
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* Spray develop module fitted with [[MF 300]] and [[MF 319]]
* Hot plate ovens and HMDS vapor prime chamber
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* Hot plate ovens and [[HMDS]] [[vapor prime]] chamber
 
* Fully automated robot handling
 
* Fully automated robot handling
  
 
===Substrate requirements===
 
===Substrate requirements===
 
* 4" and 6" wafers
 
* 4" and 6" wafers
* glass wafers not preferred for baking
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* Glass wafers not preferred for baking
  
 
===Material restrictions===
 
===Material restrictions===
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Spray develop checked weekly and maintained as needed.
 
Spray develop checked weekly and maintained as needed.
 
Robot training performed annually or as needed.
 
Robot training performed annually or as needed.
 
===Process name===
 
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Revision as of 13:09, 25 August 2015

ACS 200 cluster tool
54040.jpg
Equipment Details
Technology Lithography
Materials Restriction Semi-Clean
Material Processed SPR 220, 1813, and LNF approved photo resist syringes
Chemicals Used MF 300, MF 319, EBR, Acetone, HMDS
Equipment Manual
Overview System Overview
Operating Procedure SOP
Supported Processes Supported Processes
User Processes User Processes
Maintenance Maintenance


Warning Warning: This page has not been released yet.

The ACS 200 cluster tool is an automated photoresist coating, baking and developing tool. It can run full 4" and 6" cassettes of wafers at a time. It's capable of having multiple paths running simultaneously (ie., coating and developing from two different cassettes). It automatically pumps SPR 220-(3.0) and 1813 photoresists. Other resists can be set up to automatically dispense from a syringe. The spinner's closed lid option can help aid with more uniform sidewall coating. HMDS is applied via vapor prime. Both developers are CMOS compatible (MF 319, and MF 300). The developer temperature is controlled to within 0.1°C throughout the process.

Announcements

  • Update this with announcements as necessary

Capabilities

  • Automated spin coating
  • Automated spray developing
  • 4" and 6" wafers
PMMA and other e-beam resists should be processed in Photoresist Bench 31 in 1480A
Any other non standard photoresist must have direct approval of tool owner
SU-8 may only be processed in the ROBIN lab

System overview

Hardware details

  • RC-8 spin coater with gyrset closed cover option
  • 4" chuck will accommodate 6"
  • SPR 220-(3.0) and 1813 photo resists automatically dispensed.
  • All other approved resists can be coated with EFD dispense option.
  • Spray develop module fitted with MF 300 and MF 319
  • Hot plate ovens and HMDS vapor prime chamber
  • Fully automated robot handling

Substrate requirements

  • 4" and 6" wafers
  • Glass wafers not preferred for baking

Material restrictions

The ACS 200 cluster tool is designated as a Semi-Clean class tool. Below is a list of approved materials for the tool. Approved means the material is allowed in the tool under normal circumstances. If a material is not listed, please create a helpdesk ticket or email info@lnf.umich.edu for any material requests or questions.


Supported processes

There are several processes for this tool supported by the LNF, which are described in more detail on the Processes page.

In addition to these, users can create a helpdesk ticket requesting a modification of one of the standard recipes by a tool engnineer. Some of these recipes are documented on ACS 200 cluster tool user processes.

Standard operating procedure

Widget text will go here.

Checkout procedure

  1. Read through this page and the Standard Operating Procedure above.
  2. Practice with your mentor or another authorized user until you are comfortable with tool operation.
  3. Create a Helpdesk Ticket requesting training/checkout.
  4. A tool engineer will schedule a time for training/checkout

Maintenance

Complete spinner clean and conditioning are done semi annually or as needed. Fluid and resist fills are done/checked weekly. Hot plate ovens checked bi weekly and cleaned as needed. Spray develop checked weekly and maintained as needed. Robot training performed annually or as needed.