ACS 200 cluster tool

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ACS 200 cluster tool
Equipment Details
Technology Lithography
Materials Restriction Semi-Clean
Material Processed SPR 220, SPR 955 0.9, and LNF approved photo resist syringes
Chemicals Used MF 300, MF 319, EBR, Acetone, HMDS
Equipment Manual
Overview System Overview
Operating Procedure SOP
Supported Processes Supported Processes
User Processes User Processes
Maintenance Maintenance

The ACS 200 cluster tool is an automated photoresist coating, baking, vapor prime, stripping and developing tool. It can run full 4" and 6" cassettes of up to 25 wafers at a time. It's capable of having multiple paths running simultaneously (ie., coating and developing from two different cassettes). It automatically pumps SPR 220-(3.0) and 955 photoresists. Other resists can be set up to automatically dispense from a syringe. The spinner's closed lid option can help aid with more uniform sidewall coating. HMDS is applied via vapor prime. Both developers are CMOS compatible (MF 319, and MF 300). The developer temperature is controlled to within 0.1°C throughout the process.


  • Currently the developer and spinner module are down on the ACS. The developer module should be up by 3/21/2019. Please create a ticket if you have a time sensitive project.


  • Automated spin coating
  • Automated spray developing
  • Automated vapor prime
  • Photoresist stripping
  • 4" and 6" wafers
PMMA and other e-beam resists should be processed in Photoresist Bench 31 in 1480A
Any other non standard photoresist must have direct approval of tool owner
SU-8 may only be processed in the ROBIN lab

System overview

Hardware details

  • RC-8 spin coater with gyrset closed cover option
  • Spinner equipped with back side rinse arm for 4" wafers only
  • 4" chuck will accommodate 6"
  • SPR 220-(3.0) and SPR 955 0.9 photo resists automatically dispensed.
  • All other approved resists can be coated with EFD dispense option.
  • Spray develop module fitted with MF 300 and MF 319
  • Hot plate ovens and HMDS vapor prime chamber
  • Fully automated robot handling

Substrate requirements

  • 4" and 6" wafers
  • Glass wafers not preferred for baking

Material restrictions

The ACS 200 cluster tool is designated as a Semi-Clean class tool. Below is a list of approved materials for the tool. Approved means the material is allowed in the tool under normal circumstances. If a material is not listed, please create a helpdesk ticket or email for any material requests or questions.

Supported processes

There are several processes for this tool supported by the LNF, which are described in more detail on the SPR 220 and SPR 955 pages. The tool is already equipped with various recipes for spin coating at different thicknesses, developing at different times and baking at different temperatures. If the tool is not equipped with a recipe that you need, then please create a helpdesk ticket.

Standard operating procedure

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Checkout procedure

  1. Complete a Lithography training session. If you have already completed this for another tool, you do not need to complete it again.
  2. Read through this page and the Standard Operating Procedure above.
  3. Practice with your mentor or another authorized user until you are comfortable with tool operation.
  4. Complete the SOP quiz here
  5. Create a Helpdesk Ticket requesting training/checkout.
  6. A tool engineer will schedule a time for training/checkout


Complete spinner clean is done monthly. Fluid and resist are checked/filled weekly. Hot plate ovens cleaned bi-weekly or as needed. Spray developer is checked/filled weekly. Robot training performed annually or as needed.