Difference between revisions of "ADT 7100 Dicing Saw"

From LNF Wiki
Jump to navigation Jump to search
Line 90: Line 90:
  
 
Note:  If you foresee an issue with this procedure/process for your specific samples, you must submit a Helpdesk ticket for Staff to review.
 
Note:  If you foresee an issue with this procedure/process for your specific samples, you must submit a Helpdesk ticket for Staff to review.
 +
 +
For sapphire samples, follow all steps of procedure above, but substitute a 60 second 10:1 HF and SC2 clean instead of Piranha clean in ACID-92.  Piranha will roughen sapphire.
  
 
<span style="color: red;">For samples to be allowed into CMOS Clean tools, follow the process above and then in addition, perform a pre-furnace clean in PFC-01.</span>
 
<span style="color: red;">For samples to be allowed into CMOS Clean tools, follow the process above and then in addition, perform a pre-furnace clean in PFC-01.</span>

Revision as of 17:40, 10 January 2019



ADT 7100 Dicing Saw
130011.jpg
Equipment Details
Technology Packaging
Materials Restriction Undefined
Sample Size Pieces to 6 inch circular (150 mm)
Equipment Manual
Overview System overview
Operating Procedure SOP
Supported Processes Supported processes
User Processes User Processes
Maintenance Maintenance


The ADT 7100 Dicing Saw is optimized for multi-angle dicing of thin, tight tolerance products up to 150 mm or 6" diameter. It is capable of more complex patterns such as multiple indexes and varying cut depths.

Announcements

  • There are no announcements.

Capabilities

  • Cut Depth: Depends on the blade and flange diameter.
    • The 00777-1030-008 blade can cut up to 2 mm deep with the 4B785-4200-000 flange.
    • The 00777-1045-008 blade can cut up to 2 mm deep with the 4B785-4200-000 flange.
    • The S1230-Q5HH-000 blade can cut up to ~600 µm deep.
    • The S2550-Q5HH-000 blade can cut up to ~1100 µm deep.
    • It is possible to cut substrates thicker than 2 mm with larger blades, available by special order.
  • Wafer Size: Up to 6 inches or 150 mm circular. Rectangular substrates must fit inside of the 6 inch or 150 mm circle.

System overview

Tool specifications

Indexing Accuracy: 0.00004 inch or 1.0 µm
Cumulative Accuracy: 0.00006 inch or 1.5 µm
Cut Depth Accuracy: 0.000078 inch or 2.0 µm
Rotary Axis Accuracy: 4 arc-seconds
Chuck Rotation: 0 to 350 degrees
Feed Rate: Up to 13.7 inches/second or 350 mm/second
Return Stroke: 13.7 inches/second or 350 mm/second
Camera Magnification: Up to 120x
Blade Diameter: 2 to 3 inches or 50 to 76 mm
Spindle Speed: Up to 60,000 rpm

Substrate requirements

  • Up to 6" circular wafers.
    • Wafers of any shape that will fit in the 6" circle.
  • Any approved flat material, pieces to full wafers may be cut. Shapes other than flat pieces may require special mounting.
  • Wafers must be mounted on adhesive tape and a mounting frame.
  • Wafer thickness up to 2 mm with standard blades.

Material restrictions

Material that will be brought into the Clean Room after dicing

Process for dicing pieces in ROBIN before processing in any other tool/bench in the main cleanroom. For access to CMOS Clean tools, see note below in red.

  • Coat back side of substrate with SPR220
    • 500 RPM 5 seconds
      500 RPM/second
    • 3000 RPM 30 seconds
      1000 RPM/second
  • Bake at 115°C for 90 seconds
  • Coat front side of substrate with SPR220
    • 500 RPM 5 seconds
      500 RPM/second
    • 3000 RPM 30 seconds
      1000 RPM/second
  • Bake at 115°C for 90 seconds
  • Dice
  • Rinse for 30 seconds in DI water and remove from tape.
  • Remove PR from diced samples in ROBIN lab Solvent 94
    • Acetone in beaker at least 1 minute
    • IPA in beaker at least 1 minute
    • Dry (N2 gun)
  • Piranha clean in ROBIN lab ACID-92
  • RCA clean in main cleanroom RCA-81

Note: If you foresee an issue with this procedure/process for your specific samples, you must submit a Helpdesk ticket for Staff to review.

For sapphire samples, follow all steps of procedure above, but substitute a 60 second 10:1 HF and SC2 clean instead of Piranha clean in ACID-92. Piranha will roughen sapphire.

For samples to be allowed into CMOS Clean tools, follow the process above and then in addition, perform a pre-furnace clean in PFC-01.

These materials are allowed on the Dicing Saw. Some materials may need a special blade, including materials not noted as such below.

  • Aluminum, requires a special blade
  • BiTe
  • Fused silica/glass
  • GaAs
  • GaN
  • GaP
  • Glass
  • Hard Alumina
  • InSb
  • Li Niobate
  • PZT
  • Quartz
  • Sapphire
  • SiC
  • Silicon
  • Stainless Steel, requires a special blade

Supported processes

There are several processes for this tool supported by the LNF, which are described in more detail on the Processes page.

In addition to these, this tool has a number of user-created recipes for dicing a wide variety of materials. Some of these recipes are documented on ADT 7100 Dicing Saw User Processes. If you are curious if your material can be processed in this tool, please contact the tool engineers via the helpdesk ticket system.

Standard operating procedure

Widget text will go here.

Checkout procedure

  1. Read through this page and the Standard Operating Procedure above.
  2. Create a Helpdesk Ticket requesting training.
  3. A tool engineer will schedule a time for initial training.
  4. You may practice with your mentor or another authorized user until you are comfortable with tool operation.
  5. Schedule a checkout session with a tool engineer via the helpdesk ticket system. If this checkout is successful, the engineer will authorize you on the tool.

Maintenance

The Non-Contact Height sensor is cleaned once each week. The cutting water and filters are replaced periodically.

Process name