ADT 7100 Dicing Saw
| ADT 7100 Dicing Saw | |
|---|---|
 | |
| Equipment Details | |
| Technology | Packaging |
| Materials Restriction | Metals |
| Material Processed | Wafers and pieces less than 2mm thick |
| Sample Size | Pieces to 6 inch circular (150 mm) |
| Equipment Manual | |
| Overview | System overview |
| Operating Procedure | SOP |
| Supported Processes | Supported processes |
| User Processes | User Processes |
| Maintenance | Maintenance |
The ADT 7100 dicing saw is optimized for multi-angle dicing of thin, tight tolerance products up to 200 mm in diameter. The system is capable of complex patterns such as multiple indexes and varying cut depths. A specified blade (dependent on substrate type) cuts the workpiece in the specified patterns. The ADT 7100 dicing saw can be used to cut different materials. The process applied to each workpiece is determined by the Recipe assigned. Recipes can be assigned to an individual Workpiece or a series of Workpieces.
Contents
Announcements
- December 2023: 8" wafers can now be diced after a chuck upgrade.
Capabilities
- A maximum sample thickness of 2 mm
- Sample size up to 200 mm circular
- Dicing of diverse types of materials, including silicon, glass, sapphire, SiC, etc.
- Precise alignment with a tolerance of a few micrometers (about ten microns)
System overview
ADT tool specifications
| Indexing Accuracy: | 0.00004 inch or 1.0 µm |
| Cumulative Accuracy: | 0.00006 inch or 1.5 µm |
| Cut Depth Accuracy: | 0.000078 inch or 2.0 µm |
| Rotary Axis Accuracy: | 4 arc-seconds |
| Chuck Rotation: | 0 to 350 degrees |
| Feed Rate: | Up to 13.7 inches/second or 350 mm/second |
| Return Stroke: | 13.7 inches/second or 350 mm/second |
| Camera Magnification: | Up to 120x |
| Blade Diameter: | 2 to 3 inches or 50 to 76 mm |
| Spindle Speed: | Up to 60,000 rpm |
Substrate requirements
- Up to 8" circular wafers.
- Wafers of any shape that will fit in the 8" circle.
- Any approved flat material, pieces to whole wafers may be cut. Shapes other than flat pieces may require special mounting.
- Wafers must be mounted on adhesive tape and a mounting frame.
- Wafer thickness up to 2 mm.
Material restrictions
Samples preparation and post-dicing process cleaning
The samples that have been processed in the ADT 7100 dicing saw are considered "metal contaminated" and not suitable to run in any other system in the cleanroom immediately after. Therefore, the dicing of samples should be one of the last steps in the process flow. The following steps are mandatory if the diced samples need to be further processed in any other system in the main LNF cleanroom. Furthermore, for access to CMOS Clean tools after the dicing saw, see note below in red. for extra measurements.
- Coat the backside of the substrate with SPR-220 photoresist. At least 3um thickness is recommended.
- Bake at 120 to 130°C for about 2 to 5 min.
- Coat the front side of the substrate with SPR-220 photoresist. At least 3um thickness is recommended.
- Bake at 120 to 130°C for about 2 to 5 min.
- Dice following the standard procedure.
- Rinse for at least 30 seconds in DI water and remove from tape.
- Remove PR from diced samples in ROBIN lab Solvent 94
- Acetone in a beaker for at least 1 minute
- IPA in a beaker for at least 1 minute
- Dry (N2 gun)
- Piranha clean in ROBIN lab Acid bench 92
- RCA clean in the main cleanroom in the RCA bench 81
- For samples to be allowed into CMOS Clean tools after dicing, follow the process above and then, in addition, perform a pre-furnace clean in bench PFC 01.
̽For samples to be allowed into CMOS Clean tools, follow the process above and then in addition, perform a pre-furnace clean in PFC-01.
Extra notesː
- For sapphire samples, follow all procedure steps above, but substitute a 60 second 10:1 HF and SC2 clean instead of Piranha clean in ACID-92. Piranha will roughen sapphire.
- If you foresee an issue with this procedure/process for your specific samples, you must submit a helpdesk ticket for staff to review.
"'These materials are allowed on the Dicing Saw. Some materials may need a special blade, including materials not noted as such below.'"
- Aluminum requires a special blade
- BiTe
- Fused silica/glass
- GaAs
- GaN
- GaP
- Glass
- Hard Alumina
- InSb
- Li Niobate
- Li Tantalate
- Magnesium Fluoride
- PZT
- Quartz
- Sapphire
- SiC
- Silicon
- Stainless Steel requires a special blade
Supported processes
Several processes for this tool are supported by the LNF, which are described in more detail on the Processes page.
In addition to these, this tool has several user-created recipes for dicing a wide variety of materials. Some of these recipes are documented on ADT 7100 Dicing Saw User Processes. If you are curious if your material can be processed in this tool, please contact the tool engineers via the helpdesk ticket system.
Standard operating procedure
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- Video showing how to mount a sample on the dicing tapeː Sample mounting
- Video showing how to assemble a flange into a hubless bladeː Blade-Flange preparation
- Video showing how to disassemble flange from hubless blade ː Blade-Flange removal
- Video showing how to load the blade into the ADT system ː Blade loading
- Video showing how to unload the blade from the ADT system ː Blade unloading
Checkout procedure
- Read through this page and the Standard Operating Procedure above.
- Practice with your mentor or another authorized user until you are comfortable with tool operation. If your mentor is not an authorized user or you do not know of an authorized user who can train you, proceed to the next step.
- Create a Helpdesk Ticket requesting training. You need to describe your sample (material and geometry) and process flow to assess the requirement better. A tool engineer will schedule a time for initial training.
- Complete the checkout quiz. You may retake as necessary until all answers are correct.
- You may practice with your mentor or another authorized user until you are comfortable with tool operation.
- Schedule a checkout session with a tool engineer via the helpdesk ticket system. If this checkout is successful, the engineer will authorize you on the tool.
Maintenance
The Non-Contact Height sensor is cleaned once each week. The cutting water and filters are replaced periodically.
Process name
