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Az 12XT is a chemical enhanced positive tone photo resist (PR). In a chemical enhanced PR the exposure step creates a latent image and a week acid in the PR. The chemical reaction that makes the PR soluble in developer happens during the post exposure bake (PEB). This makes the length and temperature of the PEB extremely important. One of the advantages of the chemical enhance resits for thick resist is that it eliminate the waiting steps.

About this Process
Process Details
Equipment AZ 12XT
Technology Lithography
Chemicals Used AZ 12XT, AZ 726


Users should note that this is not a DNQ resist and is not compatible with the image reversal process used in the YES-310TA.

Contents

Procedure

for 10-25um layers

  • HMDS in YES Image Reversal Oven
  • Spin AZ 12xt
  • Softbake
    • 2-4K 3 minutes on a 110°C hotplate with the lid lowered
    • 1K 4 minutes on a 110°C hotplate with the lid lowered
  • Exposure (see characterization data below)
    • 10-17um layers
      • Contact Aligners 12-16 sec
      • Stepper 0.22-0.24 sec, Focus:-50
    • >17um
      • Contact Aligners 20-24sec
  • Post Exposure Bake
    • For 3 and 4k spins - 1 minute on a 90° hotplate with the lid lowered
    • For a 2K spin - 1.5 minutes on a 90° hotplate with the lid lowered
    • For a 1K spin - 4 minutes on a 90° hotplate with the lid lowered
  • Develop on the CEE Develop stations using 726 DP 60-60
  • Hard Bake
    • Wet processing: hard bake at 110°C for 1 minute

Characterization

Spin Curve

AZ 12xt spin curve on the CEE 100

Characterization Matrices

  • Contact Aligners: Exposure time vs Spin Speed

 

  • Contact Aligner: 1K spin, Softbake and PEB tests

 

  • Contact Aligner: Exposure time vs Development time. 1K spin CEE 100.

 

  • Exposure time vs Focus on Stepper

 

Wet Etch

 

Data Sheets