Difference between revisions of "Acid Bench 92"

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--> {{#vardefine:toolid|71181}} <!--  
 
--> {{#vardefine:toolid|71181}} <!--  
 
Set the Process Technology (see subcategories on Equipment page)  
 
Set the Process Technology (see subcategories on Equipment page)  
--> {{#vardefine:technology|Wet Bench}} <!--
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--> {{#vardefine:technology|Wet bench}} <!--
 
Set the Material Restriction Level: 1 = CMOS Clean, 2 = Semi-Clean, 3 = Metals  
 
Set the Material Restriction Level: 1 = CMOS Clean, 2 = Semi-Clean, 3 = Metals  
--> {{#vardefine:restriction|1, 2, 3}}
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--> {{#vardefine:restriction|3}}
 
{{infobox equipment
 
{{infobox equipment
|caption =  
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|caption = Acid Bench 92
|materials = metals allowed, except corrosive and toxic materials
+
|materials = metals allowed, all materials except corrosive and toxic materials
|mask =na
+
|mask =
|size =na
+
|size =
|chemicals = acid
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|chemicals = acids
|gases =  
+
|gases = na
|overview = [[{{PAGENAME}}#System_overview | System Overview]]
+
|overview = [https://docs.google.com/document/d/1psWHxOPcmAON40EqZmna7R1N28facxIQZzVXdFBdEmg/preview System Overview]
|sop = [https://link.to.google.doc/preview SOP]
+
|sop = [https://docs.google.com/document/d/1pVNo3RwndgAAXNGoQvCW4CQIGbvgjxIbl3aGjxZ_go0/preview SOP]
 
|processes = [[{{PAGENAME}}/Processes|Supported Processes]]
 
|processes = [[{{PAGENAME}}/Processes|Supported Processes]]
 
|userprocesses = [[LNF_User:{{PAGENAME}}_user_processes|User Processes]]
 
|userprocesses = [[LNF_User:{{PAGENAME}}_user_processes|User Processes]]
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}}
 
}}
  
{{warning|This page has not been released yet.}}
 
  
 
<!-- Insert the tool description here -->
 
<!-- Insert the tool description here -->
The [[{{PAGENAME}}]] is a...
+
The [[{{PAGENAME}}]] is a multi-process acid bench. It houses several plating processes as well as wafer cleaning processes like piranha, HF and PFC and etches like the HF-Nitric and multiple metal etches. There is no restriction on the materials allowed. There is a strict separation (segregation) in the glass ware to be used depending on the process and all the metal samples are first rinsed in the sink before doing the last clean in the QDR. The QDR is regularly cleaned with sulfuric and the aqua regia mixture in order to keep it ion-free.  There is an spinner drier (SRD) associated with this bench for the last cleaning step.
  
 
==Announcements==
 
==Announcements==
*Update this with announcements as necessary
+
*Update on Ni plating. Solution was serviced today (11/7/2020) plating rate confirm to follow curve in log book.
  
 
==Capabilities==
 
==Capabilities==
 
<!--A more general description of what the tool is capable of doing.-->
 
<!--A more general description of what the tool is capable of doing.-->
This is a general acid processing wet bench, supported processes are listed below. Many users processes available
+
This is a general acid processing wet bench, the LNF supported processes are listed in the next section. This bench has the hardware needed for the following plating and etching process:
* Metal etch
 
 
* Cu plating
 
* Cu plating
 
* Ni plating
 
* Ni plating
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* Fe-Ni plating
 
* Fe-Ni plating
 
* HF-Nitric anisotropic Si etch
 
* HF-Nitric anisotropic Si etch
* PFC after CMP
+
* HF etch
 
* Piranha Clean
 
* Piranha Clean
 +
* After CMP First step cleaning
  
 
==System overview==
 
==System overview==
 +
===Chemicals Allowed===
 +
This is a general use bench for acid based processes.LNF rovides the chemicals listed below
 +
* [[Buffered HF|Buffered HF (BHF)]]
 +
* [[Phosphoric acid]]
 +
* [[Nanostrip|Nanostrip]]
 +
* [[Hydrofluoric acid|Hydrofluoric acid (HF)]]
 +
* [[Sulfuric acid|Sulfuric acid (H<sub>2</sub>SO<sub>4</sub>)]]
 +
* [[Hydrogen peroxide|Hydrogen peroxide (H<sub>2</sub>O<sub>2</sub>)]]
 +
* [[Hydrochloric acid|Hydrochloric acid (HCl)]]
 +
* [[Nitric acid|Nitric acid (HNO<sub>3)]]
 +
* [[Acetic acid|Acetic acid (CH<sub>3</sub>)COOH]]
 +
 +
=== Safety===
 +
Working with chemicals can be very dangerous. Chemicals used at this bench are some of the most hazardous in the lab. To minimize the chance of accident, make sure you always:
 +
Know the properties and hazards of chemicals you are working with. If you don’t know, find out by reading about them or asking staff.
 +
Plan the details of your process. Before you start working, plan what quantities of chemicals and sample carriers you will use. Plan how you will rinse your sample and what you will do with any waste generated. Make sure you know how the controllers work.
 +
Can process pieces, 4” and 6” wafers.
 +
Do not use this bench without proper training.
 +
Waste from this bench goes into the LNF's acid waste neutralization system and then to the city sewers. No solvents can be used or disposed of in this bench.
 +
Wear the recommended PPE.
 +
{{Tip|Proper PPE for this bench are aprons, face shield, trionic gloves and safety glasses}}
 +
{{warning|You must use the buddy system for all chemical processing. No processing if you are alone in the lab. If the yellow warning lights are on it means that there are 2 or 1 people in the lab.}}
 +
 
===Hardware details===
 
===Hardware details===
 
* Bench top work: plating.  
 
* Bench top work: plating.  
 
* Several plating bath, includes sample holder, filters, stirrer, counter electrode and counter electrode holder
 
* Several plating bath, includes sample holder, filters, stirrer, counter electrode and counter electrode holder
 
* Plating pump for electrolyte recirculation
 
* Plating pump for electrolyte recirculation
* Hot plate with temperature control
+
* [[Hot_Plate_Ettiquette|Hot plate with temperature control]]
 
* Quartz heated tank for ionic clean
 
* Quartz heated tank for ionic clean
 
* HF tank
 
* HF tank
 
* Quartz Piranha tank
 
* Quartz Piranha tank
* QDR
+
* DI rinse tank
 
* Nitrogen and DI gun
 
* Nitrogen and DI gun
 
* Waste liquid aspirator
 
* Waste liquid aspirator
  
 
The acid waste goes to neutralization plant before is released into city sewage.
 
The acid waste goes to neutralization plant before is released into city sewage.
 +
 +
===Additional Equipment===
 +
* Pulse plating Power supply
 +
* Hot Plate
 +
* Plating baths
 +
* Diaphragm pump for plating
  
 
===Substrate requirements===
 
===Substrate requirements===
* Wafer Size
+
* Many sample sizes can be accommodated in this bench. Tanks and existing labware can accommodate up to 150mm wafers.
* Wafer type
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* Many types of materials are allowed in this bench.
* Any mounting?
 
* Wafer thickness
 
  
 
===Material restrictions===
 
===Material restrictions===
 
{{material restrictions}}
 
{{material restrictions}}
  
 +
The acid waste goes to neutralization plant before is released into city sewage.
 
==Supported processes==  
 
==Supported processes==  
 +
This is a general acid processing wet bench, supported processes are listed below. The LNF supported processes are described in more detail on the [[/Processes/]] page.<br />Though, private, user requested processes are allowed.
 +
* Metal etch
 +
* Cu plating
 +
* Ni plating
 +
* In plating
 +
* Fe-Ni plating
 +
* HF-Nitric anisotropic Si etch
 +
* PFC after CMP
 +
* [[Piranha Etch|Piranha Etch]]
 +
* HF etch
 
<!-- We recommend creating a subpage detailing the supported processes for the tool, which will be generated if you leave the link below. Alternatively, you may include the information on this page. In that case, the Supported Processes document from the equipment manual can be included here, using {{#widget:GoogleDoc|key=googledocid}} -->
 
<!-- We recommend creating a subpage detailing the supported processes for the tool, which will be generated if you leave the link below. Alternatively, you may include the information on this page. In that case, the Supported Processes document from the equipment manual can be included here, using {{#widget:GoogleDoc|key=googledocid}} -->
  
There are several processes for this tool supported by the LNF, which are described in more detail on the [[/Processes/]] page.
+
There are several processes for this tool supported by the LNF, which are described in more detail on the [[/Processes/]] page.<br />
 +
 
 +
New processes:<br />
 +
# Discuss with Staff
 +
# Write and SOP
 +
# Practice with staff the first time process is run
 +
# Correct SOP
  
 
<!-- If you allow custom recipes, let users know to contact a tool engineer, and you may also create the link below which will create a page that users can add custom recipes to. -->
 
<!-- If you allow custom recipes, let users know to contact a tool engineer, and you may also create the link below which will create a page that users can add custom recipes to. -->
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==Standard operating procedure==
 
==Standard operating procedure==
 
<!-- To include a document from google docs, use the line below, replace "googledocid" with the ID for the document. Remember, to make this visible, you must set Sharing for the document to "Anyone with the link can view". -->
 
<!-- To include a document from google docs, use the line below, replace "googledocid" with the ID for the document. Remember, to make this visible, you must set Sharing for the document to "Anyone with the link can view". -->
{{#widget:GoogleDoc|key=googledocid}}
+
{{#widget:GoogleDoc|key=1pVNo3RwndgAAXNGoQvCW4CQIGbvgjxIbl3aGjxZ_go0}}
  
 
==Checkout procedure==
 
==Checkout procedure==
 
<!-- Describe the checkout procedure for the tool. For example: -->
 
<!-- Describe the checkout procedure for the tool. For example: -->
# Read through this page and the Standard Operating Procedure above.
+
# Complete [[General Wet Bench Training]]
# Complete the training request form [http://examplelink.com here].
+
# Read through this page and the general Standard Operating Procedure above.  
# Create a [http://ssel-sched.eecs.umich.edu/sselScheduler/ResourceContact.aspx?tabindex=3&path=0:0:0:{{#var:toolid}} Helpdesk Ticket] requesting training.
+
# Fill out [https://docs.google.com/forms/d/e/1FAIpQLScv9PDTq-3nFVrJf_9HG0xi7wZNZVCEVTcW-IhgWFhlnkds4g/viewform?usp=sf_link Process request form]
# A tool engineer will schedule a time for initial training.
+
# Create a [http://ssel-sched.eecs.umich.edu/sselScheduler/ResourceContact.aspx?tabindex=3&path=0:0:0:{{#var:toolid}} Helpdesk Ticket] requesting training/ Checkout
# Practice with your mentor or another authorized user until you are comfortable with tool operation.
 
# Complete the SOP quiz [http://examplelink.com here].
 
# Schedule a checkout session with a tool engineer via the helpdesk ticket system. If this checkout is successful, the engineer will authorize you on the tool.
 
  
 
==Maintenance==  
 
==Maintenance==  
<!-- Describe standard maintenance/qualification tests here -->
+
Besides the general cleaning during lab clean, this bench different baths and the D/R gets treated with 10% sulfuric regularly.
 
 
===Process name===
 
<!-- This is an example a chart published with etch data. You can just replace the url with your own. -->
 
{{#widget:Iframe
 
|url=chart url
 
|width=800
 
|height=400
 
|border=0
 
}}
 

Latest revision as of 13:27, 19 November 2021

Acid Bench 92
71181.jpg
Acid Bench 92
Equipment Details
Technology Wet bench
Materials Restriction Metals
Material Processed metals allowed, all materials except corrosive and toxic materials
Chemicals Used acids
Gases Used na
Equipment Manual
Overview System Overview
Operating Procedure SOP
Supported Processes Supported Processes
User Processes User Processes
Maintenance Maintenance



The Acid Bench 92 is a multi-process acid bench. It houses several plating processes as well as wafer cleaning processes like piranha, HF and PFC and etches like the HF-Nitric and multiple metal etches. There is no restriction on the materials allowed. There is a strict separation (segregation) in the glass ware to be used depending on the process and all the metal samples are first rinsed in the sink before doing the last clean in the QDR. The QDR is regularly cleaned with sulfuric and the aqua regia mixture in order to keep it ion-free. There is an spinner drier (SRD) associated with this bench for the last cleaning step.

Announcements

  • Update on Ni plating. Solution was serviced today (11/7/2020) plating rate confirm to follow curve in log book.

Capabilities

This is a general acid processing wet bench, the LNF supported processes are listed in the next section. This bench has the hardware needed for the following plating and etching process:

  • Cu plating
  • Ni plating
  • In plating
  • Fe-Ni plating
  • HF-Nitric anisotropic Si etch
  • HF etch
  • Piranha Clean
  • After CMP First step cleaning

System overview

Chemicals Allowed

This is a general use bench for acid based processes.LNF rovides the chemicals listed below

Safety

Working with chemicals can be very dangerous. Chemicals used at this bench are some of the most hazardous in the lab. To minimize the chance of accident, make sure you always: Know the properties and hazards of chemicals you are working with. If you don’t know, find out by reading about them or asking staff. Plan the details of your process. Before you start working, plan what quantities of chemicals and sample carriers you will use. Plan how you will rinse your sample and what you will do with any waste generated. Make sure you know how the controllers work. Can process pieces, 4” and 6” wafers. Do not use this bench without proper training. Waste from this bench goes into the LNF's acid waste neutralization system and then to the city sewers. No solvents can be used or disposed of in this bench. Wear the recommended PPE.

Proper PPE for this bench are aprons, face shield, trionic gloves and safety glasses
Warning Warning: You must use the buddy system for all chemical processing. No processing if you are alone in the lab. If the yellow warning lights are on it means that there are 2 or 1 people in the lab.

Hardware details

  • Bench top work: plating.
  • Several plating bath, includes sample holder, filters, stirrer, counter electrode and counter electrode holder
  • Plating pump for electrolyte recirculation
  • Hot plate with temperature control
  • Quartz heated tank for ionic clean
  • HF tank
  • Quartz Piranha tank
  • DI rinse tank
  • Nitrogen and DI gun
  • Waste liquid aspirator

The acid waste goes to neutralization plant before is released into city sewage.

Additional Equipment

  • Pulse plating Power supply
  • Hot Plate
  • Plating baths
  • Diaphragm pump for plating

Substrate requirements

  • Many sample sizes can be accommodated in this bench. Tanks and existing labware can accommodate up to 150mm wafers.
  • Many types of materials are allowed in this bench.

Material restrictions

The Acid Bench 92 is designated as a Metals class tool. Below is a list of approved materials for the tool. Approved means the material is allowed in the tool under normal circumstances. If a material is not listed, please create a helpdesk ticket or email info@lnf.umich.edu for any material requests or questions.


The acid waste goes to neutralization plant before is released into city sewage.

Supported processes

This is a general acid processing wet bench, supported processes are listed below. The LNF supported processes are described in more detail on the Processes page.
Though, private, user requested processes are allowed.

  • Metal etch
  • Cu plating
  • Ni plating
  • In plating
  • Fe-Ni plating
  • HF-Nitric anisotropic Si etch
  • PFC after CMP
  • Piranha Etch
  • HF etch

There are several processes for this tool supported by the LNF, which are described in more detail on the Processes page.

New processes:

  1. Discuss with Staff
  2. Write and SOP
  3. Practice with staff the first time process is run
  4. Correct SOP

In addition to these, this tool has a number of user-created recipes for etching a wide variety of materials. Some of these recipes are documented on Acid Bench 92 user processes. If you are curious if your material can be processed in this tool, please contact the tool engineers via the helpdesk ticket system.

Standard operating procedure

Widget text will go here.

Checkout procedure

  1. Complete General Wet Bench Training
  2. Read through this page and the general Standard Operating Procedure above.
  3. Fill out Process request form
  4. Create a Helpdesk Ticket requesting training/ Checkout

Maintenance

Besides the general cleaning during lab clean, this bench different baths and the D/R gets treated with 10% sulfuric regularly.