Difference between revisions of "Aluminum"
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{{#vardefine:restriction|0}} <!-- Set the Material Restriction Level: 1 = CMOS Clean, 2 = Semi-Clean, 3 = Metals, 4 = varies --> | {{#vardefine:restriction|0}} <!-- Set the Material Restriction Level: 1 = CMOS Clean, 2 = Semi-Clean, 3 = Metals, 4 = varies --> | ||
Aluminum is a metal that is a silvery-white, soft, non-magnetic and ductile in the boron group. | Aluminum is a metal that is a silvery-white, soft, non-magnetic and ductile in the boron group. | ||
| − | == | + | ==Processing Equipment== |
| − | + | Process technologies that can be used to deposit/pattern this material. If this is a substrate, refer to what tool/process restrictions there may be and possibly remove the following sub-sections. | |
| − | |||
===Deposition Equipment=== | ===Deposition Equipment=== | ||
*[[Lab 18-2]] | *[[Lab 18-2]] | ||
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*[[Dektak XT Surface Profilometer]] | *[[Dektak XT Surface Profilometer]] | ||
| − | == | + | ==Applications== |
| − | + | *Aluminum is a commonly deposited metal in the lab. It has a high reflectivity for optical devices. | |
==Processes== | ==Processes== | ||
Revision as of 09:01, 22 April 2020
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Aluminum is a metal that is a silvery-white, soft, non-magnetic and ductile in the boron group.
Contents
Processing Equipment
Process technologies that can be used to deposit/pattern this material. If this is a substrate, refer to what tool/process restrictions there may be and possibly remove the following sub-sections.
Deposition Equipment
Etching Equipment
- Acid Bench 12 - maintained tank
- Acid Bench 73 - Beaker
- Acid Bench 80 - Beaker
- LAM 9400
Characterization Equipment
Applications
- Aluminum is a commonly deposited metal in the lab. It has a high reflectivity for optical devices.
Processes
Depositoin Processes
Etch Processes
- Wet etching
- Wet etching can be used to etch aluminum using Aluminum Etch at Acid Bench 12, Acid Bench 73, and Acid Bench 80.
- Reactive ion etching
Characterization Processes
- The profilometer can be used to measure the thickness of your deposition.
References
- Etch rates for micromachining processing https://ieeexplore.ieee.org/abstract/document/546406
- Etch rates for micromachining processing-Part II https://ieeexplore.ieee.org/abstract/document/1257354
