Difference between revisions of "Aluminum"
Jump to navigation
Jump to search
| (34 intermediate revisions by 3 users not shown) | |||
| Line 2: | Line 2: | ||
{{warning|This page has not been released yet.}} | {{warning|This page has not been released yet.}} | ||
{{#vardefine:restriction|0}} <!-- Set the Material Restriction Level: 1 = CMOS Clean, 2 = Semi-Clean, 3 = Metals, 4 = varies --> | {{#vardefine:restriction|0}} <!-- Set the Material Restriction Level: 1 = CMOS Clean, 2 = Semi-Clean, 3 = Metals, 4 = varies --> | ||
| − | + | Aluminum is a metal that is a silvery-white, soft, non-magnetic and ductile in the boron group. | |
| − | + | ==Processing Equipment== | |
| − | + | Process technologies that can be used to deposit/pattern this material. If this is a substrate, refer to what tool/process restrictions there may be and possibly remove the following sub-sections. | |
| − | + | ===Deposition Equipment=== | |
| − | + | *[[Lab 18-2]] | |
| − | + | *[[Enerjet Evaporator]] | |
| − | + | *[[Angstrom Engineering Evovac Evaporator]] | |
| + | *[[PVD 75 Proline]] | ||
| + | |||
| + | ===Etching Equipment=== | ||
| + | *[[Acid Bench 12]] - maintained tank | ||
| + | *[[Acid Bench 73]] - Beaker | ||
| + | *[[Acid Bench 80]] - Beaker | ||
| + | *[[LAM 9400]] | ||
| − | + | ===Characterization Equipment=== | |
| + | *[[Dektak XT]] | ||
| − | == | + | ==Applications== |
| − | + | *Aluminum is a commonly deposited metal in the lab. It has a high reflectivity for optical devices. | |
| − | === | + | ==Processes== |
| + | ===Depositoin Processes=== | ||
| + | *[[Electron_beam_evaporation|E-beam evaporation]] | ||
| − | + | *[[Sputter_deposition|Sputter deposition]] | |
| − | |||
| − | |||
| − | |||
| − | |||
| − | ===Processes=== | + | ===Etch Processes=== |
| − | * | + | *[[Wet etching|Wet etching]] |
| − | + | **Wet etching can be used to etch aluminum using [[Aluminum Etch]] at [[Acid Bench 12]], [[Acid Bench 73]], and [[ Acid Bench 80]]. | |
| + | *[[Reactive ion etching]] | ||
| − | === | + | ===Characterization Processes=== |
| − | + | *The profilometer can be used to measure the thickness of your deposition. | |
==References== | ==References== | ||
| − | * | + | *'''Etch rates for micromachining processing''' https://ieeexplore.ieee.org/abstract/document/546406 |
| + | *'''Etch rates for micromachining processing-Part II''' https://ieeexplore.ieee.org/abstract/document/1257354 | ||
Latest revision as of 08:02, 22 April 2020
 Warning: | This page has not been released yet. |
Aluminum is a metal that is a silvery-white, soft, non-magnetic and ductile in the boron group.
Contents
Processing Equipment
Process technologies that can be used to deposit/pattern this material. If this is a substrate, refer to what tool/process restrictions there may be and possibly remove the following sub-sections.
Deposition Equipment
Etching Equipment
- Acid Bench 12 - maintained tank
- Acid Bench 73 - Beaker
- Acid Bench 80 - Beaker
- LAM 9400
Characterization Equipment
Applications
- Aluminum is a commonly deposited metal in the lab. It has a high reflectivity for optical devices.
Processes
Depositoin Processes
Etch Processes
- Wet etching
- Wet etching can be used to etch aluminum using Aluminum Etch at Acid Bench 12, Acid Bench 73, and Acid Bench 80.
- Reactive ion etching
Characterization Processes
- The profilometer can be used to measure the thickness of your deposition.
References
- Etch rates for micromachining processing https://ieeexplore.ieee.org/abstract/document/546406
- Etch rates for micromachining processing-Part II https://ieeexplore.ieee.org/abstract/document/1257354
