Difference between revisions of "Aluminum"
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{{#vardefine:restriction|0}} <!-- Set the Material Restriction Level: 1 = CMOS Clean, 2 = Semi-Clean, 3 = Metals, 4 = varies --> | {{#vardefine:restriction|0}} <!-- Set the Material Restriction Level: 1 = CMOS Clean, 2 = Semi-Clean, 3 = Metals, 4 = varies --> | ||
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Aluminum is a metal that is a silvery-white, soft, non-magnetic and ductile in the boron group. | Aluminum is a metal that is a silvery-white, soft, non-magnetic and ductile in the boron group. | ||
| − | + | ==Processing Equipment== | |
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| − | ==Processing | ||
Process technologies that can be used to deposit/pattern this material. If this is a substrate, refer to what tool/process restrictions there may be and possibly remove the following sub-sections. | Process technologies that can be used to deposit/pattern this material. If this is a substrate, refer to what tool/process restrictions there may be and possibly remove the following sub-sections. | ||
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===Deposition Equipment=== | ===Deposition Equipment=== | ||
*[[Lab 18-2]] | *[[Lab 18-2]] | ||
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*[[Acid Bench 12]] - maintained tank | *[[Acid Bench 12]] - maintained tank | ||
*[[Acid Bench 73]] - Beaker | *[[Acid Bench 73]] - Beaker | ||
| − | *[[Acid Bench | + | *[[Acid Bench 80]] - Beaker |
| + | *[[LAM 9400]] | ||
| + | |||
| + | ===Characterization Equipment=== | ||
| + | *[[Dektak XT]] | ||
| + | |||
| + | ==Applications== | ||
| + | *Aluminum is a commonly deposited metal in the lab. It has a high reflectivity for optical devices. | ||
==Processes== | ==Processes== | ||
| − | ====[[Electron_beam_evaporation|E-beam evaporation]] | + | ===Depositoin Processes=== |
| − | + | *[[Electron_beam_evaporation|E-beam evaporation]] | |
| − | * [[ | + | |
| − | + | *[[Sputter_deposition|Sputter deposition]] | |
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===Etch Processes=== | ===Etch Processes=== | ||
| − | + | *[[Wet etching|Wet etching]] | |
| − | Wet etching can be used to etch aluminum using [[Aluminum Etch]] | + | **Wet etching can be used to etch aluminum using [[Aluminum Etch]] at [[Acid Bench 12]], [[Acid Bench 73]], and [[ Acid Bench 80]]. |
| − | + | *[[Reactive ion etching]] | |
| − | + | ||
| + | ===Characterization Processes=== | ||
| + | *The profilometer can be used to measure the thickness of your deposition. | ||
==References== | ==References== | ||
*'''Etch rates for micromachining processing''' https://ieeexplore.ieee.org/abstract/document/546406 | *'''Etch rates for micromachining processing''' https://ieeexplore.ieee.org/abstract/document/546406 | ||
*'''Etch rates for micromachining processing-Part II''' https://ieeexplore.ieee.org/abstract/document/1257354 | *'''Etch rates for micromachining processing-Part II''' https://ieeexplore.ieee.org/abstract/document/1257354 | ||
Latest revision as of 09:02, 22 April 2020
 Warning: | This page has not been released yet. |
Aluminum is a metal that is a silvery-white, soft, non-magnetic and ductile in the boron group.
Contents
Processing Equipment
Process technologies that can be used to deposit/pattern this material. If this is a substrate, refer to what tool/process restrictions there may be and possibly remove the following sub-sections.
Deposition Equipment
Etching Equipment
- Acid Bench 12 - maintained tank
- Acid Bench 73 - Beaker
- Acid Bench 80 - Beaker
- LAM 9400
Characterization Equipment
Applications
- Aluminum is a commonly deposited metal in the lab. It has a high reflectivity for optical devices.
Processes
Depositoin Processes
Etch Processes
- Wet etching
- Wet etching can be used to etch aluminum using Aluminum Etch at Acid Bench 12, Acid Bench 73, and Acid Bench 80.
- Reactive ion etching
Characterization Processes
- The profilometer can be used to measure the thickness of your deposition.
References
- Etch rates for micromachining processing https://ieeexplore.ieee.org/abstract/document/546406
- Etch rates for micromachining processing-Part II https://ieeexplore.ieee.org/abstract/document/1257354
