Difference between revisions of "Aluminum"

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{{warning|This page has not been released yet.}}
 
{{warning|This page has not been released yet.}}
 
{{#vardefine:restriction|0}} <!-- Set the Material Restriction Level: 1 = CMOS Clean, 2 = Semi-Clean, 3 = Metals, 4 = varies -->
 
{{#vardefine:restriction|0}} <!-- Set the Material Restriction Level: 1 = CMOS Clean, 2 = Semi-Clean, 3 = Metals, 4 = varies -->
{{Infobox material
 
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Aluminum is a metal that is a silvery-white, soft, non-magnetic and ductile in the boron group.  
 
Aluminum is a metal that is a silvery-white, soft, non-magnetic and ductile in the boron group.  
 
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==Processing Equipment==
==Processing Tools==
 
 
Process technologies that can be used to deposit/pattern this material.  If this is a substrate, refer to what tool/process restrictions there may be and possibly remove the following sub-sections.
 
Process technologies that can be used to deposit/pattern this material.  If this is a substrate, refer to what tool/process restrictions there may be and possibly remove the following sub-sections.
 
 
===Deposition Equipment===
 
===Deposition Equipment===
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*[[Lab 18-2]]
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*[[Enerjet Evaporator]]
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*[[Angstrom Engineering Evovac Evaporator]]
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*[[PVD 75 Proline]]
  
 
===Etching Equipment===
 
===Etching Equipment===
* Wet Etching
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*[[Acid Bench 12]] - maintained tank
**[[Acid Bench 12]] - maintained tank
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*[[Acid Bench 73]] - Beaker
**[[Acid Bench 73]] - Beaker
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*[[Acid Bench 80]] - Beaker
**[[Acid Bench 82]] - Beaker
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*[[LAM 9400]]
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===Characterization Equipment===
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*[[Dektak XT]]
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==Applications==
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*Aluminum is a commonly deposited metal in the lab. It has a high reflectivity for optical devices.
  
 
==Processes==
 
==Processes==
* List of processes for this material
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===Depositoin Processes===
===Deposition===
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*[[Electron_beam_evaporation|E-beam evaporation]]
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*[[Sputter_deposition|Sputter deposition]]
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===Etch Processes===
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*[[Wet etching|Wet etching]]
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**Wet etching can be used to etch aluminum using [[Aluminum Etch]] at [[Acid Bench 12]], [[Acid Bench 73]], and [[ Acid Bench 80]].
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*[[Reactive ion etching]]
  
===Etching===
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===Characterization Processes===
Chemical etching is done using [[Aluminum Etch]].  You can find etch rates for aluminum from ["Etch rates for micromachining processing"] and ["Etch rates for micromachining processing-Part II"].
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*The profilometer can be used to measure the thickness of your deposition.
  
 
==References==
 
==References==
 
*'''Etch rates for micromachining processing''' https://ieeexplore.ieee.org/abstract/document/546406
 
*'''Etch rates for micromachining processing''' https://ieeexplore.ieee.org/abstract/document/546406
 
*'''Etch rates for micromachining processing-Part II''' https://ieeexplore.ieee.org/abstract/document/1257354
 
*'''Etch rates for micromachining processing-Part II''' https://ieeexplore.ieee.org/abstract/document/1257354

Latest revision as of 08:02, 22 April 2020

Warning Warning: This page has not been released yet.

Aluminum is a metal that is a silvery-white, soft, non-magnetic and ductile in the boron group.

Processing Equipment

Process technologies that can be used to deposit/pattern this material. If this is a substrate, refer to what tool/process restrictions there may be and possibly remove the following sub-sections.

Deposition Equipment

Etching Equipment

Characterization Equipment

Applications

  • Aluminum is a commonly deposited metal in the lab. It has a high reflectivity for optical devices.

Processes

Depositoin Processes

Etch Processes

Characterization Processes

  • The profilometer can be used to measure the thickness of your deposition.

References