Difference between revisions of "Aluminum"

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{{warning|This page has not been released yet.}}
 
{{warning|This page has not been released yet.}}
 
{{#vardefine:restriction|0}} <!-- Set the Material Restriction Level: 1 = CMOS Clean, 2 = Semi-Clean, 3 = Metals, 4 = varies -->
 
{{#vardefine:restriction|0}} <!-- Set the Material Restriction Level: 1 = CMOS Clean, 2 = Semi-Clean, 3 = Metals, 4 = varies -->
{{Infobox material
 
|image      =
 
|caption    =
 
|category  =
 
|properties =
 
|names      =
 
}}
 
 
 
Aluminum is a metal that is a silvery-white, soft, non-magnetic and ductile in the boron group.  
 
Aluminum is a metal that is a silvery-white, soft, non-magnetic and ductile in the boron group.  
==Applications==
+
==Processing Equipment==
*Discuss common uses/applications for this material. Why this materials is used in the LNF?
 
 
 
==Processing Tools==
 
 
Process technologies that can be used to deposit/pattern this material.  If this is a substrate, refer to what tool/process restrictions there may be and possibly remove the following sub-sections.
 
Process technologies that can be used to deposit/pattern this material.  If this is a substrate, refer to what tool/process restrictions there may be and possibly remove the following sub-sections.
 
 
===Deposition Equipment===
 
===Deposition Equipment===
 
*[[Lab 18-2]]
 
*[[Lab 18-2]]
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*[[Acid Bench 12]] - maintained tank
 
*[[Acid Bench 12]] - maintained tank
 
*[[Acid Bench 73]] - Beaker
 
*[[Acid Bench 73]] - Beaker
*[[Acid Bench 82]] - Beaker
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*[[Acid Bench 80]] - Beaker
 +
*[[LAM 9400]]
 +
 
 +
===Characterization Equipment===
 +
*[[Dektak XT]]
 +
 
 +
==Applications==
 +
*Aluminum is a commonly deposited metal in the lab. It has a high reflectivity for optical devices.
  
 
==Processes==
 
==Processes==
====[[Electron_beam_evaporation|E-beam evaporation]]====
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===Depositoin Processes===
* [[Angstrom Engineering Evovac Evaporator]]
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*[[Electron_beam_evaporation|E-beam evaporation]]
* [[Enerjet Evaporator]]
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* [[SJ-20 Evaporator]]
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*[[Sputter_deposition|Sputter deposition]]
  
====[[Sputter_deposition|Sputter deposition]]====
 
 
===Etch Processes===
 
===Etch Processes===
====[[Wet etching|Wet etching]]====
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*[[Wet etching|Wet etching]]
Wet etching can be used to etch aluminum using [[Aluminum Etch]]
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**Wet etching can be used to etch aluminum using [[Aluminum Etch]] at [[Acid Bench 12]], [[Acid Bench 73]], and [[ Acid Bench 80]].
**[[Acid Bench 12]]
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*[[Reactive ion etching]]
**[[Acid Bench 73]]
+
 
 +
===Characterization Processes===
 +
*The profilometer can be used to measure the thickness of your deposition.
  
 
==References==
 
==References==
 
*'''Etch rates for micromachining processing''' https://ieeexplore.ieee.org/abstract/document/546406
 
*'''Etch rates for micromachining processing''' https://ieeexplore.ieee.org/abstract/document/546406
 
*'''Etch rates for micromachining processing-Part II''' https://ieeexplore.ieee.org/abstract/document/1257354
 
*'''Etch rates for micromachining processing-Part II''' https://ieeexplore.ieee.org/abstract/document/1257354

Latest revision as of 08:02, 22 April 2020

Warning Warning: This page has not been released yet.

Aluminum is a metal that is a silvery-white, soft, non-magnetic and ductile in the boron group.

Processing Equipment

Process technologies that can be used to deposit/pattern this material. If this is a substrate, refer to what tool/process restrictions there may be and possibly remove the following sub-sections.

Deposition Equipment

Etching Equipment

Characterization Equipment

Applications

  • Aluminum is a commonly deposited metal in the lab. It has a high reflectivity for optical devices.

Processes

Depositoin Processes

Etch Processes

Characterization Processes

  • The profilometer can be used to measure the thickness of your deposition.

References