Difference between revisions of "Aluminum"
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==Applications== | ==Applications== | ||
*Discuss common uses/applications for this material. Why this materials is used in the LNF? | *Discuss common uses/applications for this material. Why this materials is used in the LNF? | ||
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===Deposition Equipment=== | ===Deposition Equipment=== | ||
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*[[Acid Bench 80]] - Beaker | *[[Acid Bench 80]] - Beaker | ||
*[[LAM 9400]] | *[[LAM 9400]] | ||
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| + | ===Characterization Equipment=== | ||
| + | *[[Dektak XT Surface Profilometer]] | ||
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| + | ==Processing Equipment== | ||
| + | Process technologies that can be used to deposit/pattern this material. If this is a substrate, refer to what tool/process restrictions there may be and possibly remove the following sub-sections. | ||
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==Processes== | ==Processes== | ||
===Depositoin Processes=== | ===Depositoin Processes=== | ||
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**Wet etching can be used to etch aluminum using [[Aluminum Etch]] at [[Acid Bench 12]], [[Acid Bench 73]], and [[ Acid Bench 80]]. | **Wet etching can be used to etch aluminum using [[Aluminum Etch]] at [[Acid Bench 12]], [[Acid Bench 73]], and [[ Acid Bench 80]]. | ||
*[[Reactive ion etching]] | *[[Reactive ion etching]] | ||
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| + | ===Characterization Processes=== | ||
| + | *The profilometer can be used to measure the thickness of your deposition. | ||
==References== | ==References== | ||
*'''Etch rates for micromachining processing''' https://ieeexplore.ieee.org/abstract/document/546406 | *'''Etch rates for micromachining processing''' https://ieeexplore.ieee.org/abstract/document/546406 | ||
*'''Etch rates for micromachining processing-Part II''' https://ieeexplore.ieee.org/abstract/document/1257354 | *'''Etch rates for micromachining processing-Part II''' https://ieeexplore.ieee.org/abstract/document/1257354 | ||
Revision as of 08:53, 22 April 2020
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Aluminum is a metal that is a silvery-white, soft, non-magnetic and ductile in the boron group.
Contents
Applications
- Discuss common uses/applications for this material. Why this materials is used in the LNF?
Deposition Equipment
Etching Equipment
- Acid Bench 12 - maintained tank
- Acid Bench 73 - Beaker
- Acid Bench 80 - Beaker
- LAM 9400
Characterization Equipment
Processing Equipment
Process technologies that can be used to deposit/pattern this material. If this is a substrate, refer to what tool/process restrictions there may be and possibly remove the following sub-sections.
Processes
Depositoin Processes
Etch Processes
- Wet etching
- Wet etching can be used to etch aluminum using Aluminum Etch at Acid Bench 12, Acid Bench 73, and Acid Bench 80.
- Reactive ion etching
Characterization Processes
- The profilometer can be used to measure the thickness of your deposition.
References
- Etch rates for micromachining processing https://ieeexplore.ieee.org/abstract/document/546406
- Etch rates for micromachining processing-Part II https://ieeexplore.ieee.org/abstract/document/1257354
