CEE 100CB photoresist spinner

CEE 100CB photoresist spinner
Equipment Details
Technology	Lithography
Materials Restriction	General
Material Processed	Photoresist
Sample Size	pieces up to 6" wafers
Chemicals Used	Acetone, IPA
Equipment Manual
Overview	System Overview
Operating Procedure	SOP
Supported Processes	Supported Processes
Maintenance	Maintenance

The CEE 100CB Spinner is a fully programmable, manual dispense, photoresist spinner located in the main cleanroom at the LNF. It can accept pieces, 4" and 6" wafers. It is located in 1440C.

Announcements

The dispensing guns have recently been modified to stay in trigger position 2, please do not force it into position 1 or R.

Capabilities

• Available Photoresists
  • SPR 220 (3.0)
  • SPR 220 (7.0)
  • S1813
• Allowed Photoresists
  • KMPR
  • AZ 9260
  • LOR

PMMA and other e-beam resists should be processed in Photoresist Bench 31 in 1480A

Any other non standard photoresist must have direct approval of tool owner

SU-8 may only be processed in the ROBIN lab

System Overview

Hardware Details

• Up to 5K rpm spin rates
• Hot plate maintained at 115°C

Substrate Requirements

• From 10x10 mm pieces up to 150 mm (6 inch) wafers
• No substrate material requirements
• Available Chucks
  • 6" Chuck (Ø 3.75")
  • 4" Chuck (Ø 2.25")
  • Large Piece Chuck (Ø 0.75")
  • Small Piece Chuck (Ø 0.25" - chuck ; Ø 0.375" - O-ring)

Please choose a chuck sized appropriately for your sample. Your sample must fully cover the top surface of the chuck to prevent photoresist from being sucked into the vacuum hole. The tools may be damaged if photoresist or solvent goes into the vacuum hole in the spindle. Incorrect chuck use will result in loss of tool access.

• 

  Correct chuck for sample

• 

  Incorrect chuck for sample - a smaller chuck should be used

Material Restrictions

The CEE 100CB photoresist spinner is designated as a General class tool. Below is a list of approved materials for the tool. Approved means the material is allowed in the tool under normal circumstances. If a material is not listed, please create a helpdesk ticket or email info@lnf.umich.edu for any material requests or questions.

Approved materials

Supported Processes

There are 10 recipe slots in the software, used as follows:

• 8 fixed spin recipes (recipes 1-8), 1 stripping recipe (recipe 9), 1 manual recipe (recipe 0)
  • 4 recipes (1000-4000 rpm) for thin resists (e.g. SPR 220 3.0)
  • 4 recipes (1000-4000 rpm) for thick resists (e.g. KMPR 1010)
• Only recipe 0 is allowed to be changed, instructions on how to do so can be found in the SOP

More information on the recipe details can be found in the standard processes document. For more information on photoresist spinning and recommended lithoraphy processes, please read the Lithography page. For information on a specific photoresist, please check the datasheet.

Standard Operating Procedure

• Standard Operating Procedure
• Custom Recipe
• Troubleshooting

Checkout procedure

1. Complete a Lithography training session. If you have already completed this for another tool, you do not need to complete it again.
2. Practice on the tool with your mentor
3. Read this page and the SOP
4. Take the quiz found here
5. Schedule a time for a checkout here
6. Create a helpdesk ticket for final confirmation of your checkout appointment.
7. If this checkout is successful, the engineer will authorize you on the tool.

Maintenance

The bowl, chucks, and hotplate are cleaned each week during lab clean. The protective lining in the bowl is replaced weekly as necessary.

User authorized maintenance

In the event of a power bump, users may run the startup/shutdown procedure.