CEE 200X photoresist spinner 1

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CEE 200X photoresist spinner 1
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Equipment Details
Technology Lithography
Materials Restriction Metals
Material Processed SPR 220 (3.0)
SPR 220 (7.0)
Sample Size pieces up to 6" wafers
Equipment Manual
Overview System Overview
Operating Procedure SOP
Supported Processes Supported Processes
Maintenance Maintenance


The CEE 200X photoresist spinner 1 is a fully programmable, automatic dispense, photoresist spinner located in 1440C. It can accept pieces, 4" and 6" wafers. It has automatic photoresist dispensers, but can also accommodate manual dispensing.

Announcements

  • None at this time.

Capabilities

Equipped Photoresists: SPR 220 (3.0), SPR 220 (7.0), SPR 955 (0.9) Note: When spinning SPR 220 (7.0) you will often get micro bubbles in the film. For a manual dispense you can reduce the number of bubbles by sonicating the syringe before hand. For more details please make a helpdesk ticket.

SU-8 must be processed in the ROBIN lab
PMMA and other e-beam resists should be processed in Photoresist Bench 31
For all other materials, please contact staff to request approval

System overview

Hardware details

  • Up to 6K rpm spin rates
  • Hot plate up to 200°C
  • Photoresist is dispensed automatically with an equipped photoresist or through an EFD tube.

Substrate requirements

  • 1x1 cm pieces up to 6" wafers
  • No substrate material requirements
  • Available Chucks
    • 6" Chuck (Ø 3.75")
    • 4" Chuck (Ø 2.25")
    • Large Piece Chuck (Ø 0.75")
    • Small Piece Chuck (Ø 0.25" - chuck ; Ø 0.375" - O-ring)

Material restrictions

The CEE 200X photoresist spinner 1 is designated as a Metals class tool. Below is a list of approved materials for the tool. Approved means the material is allowed in the tool under normal circumstances. If a material is not listed, please create a helpdesk ticket or email info@lnf.umich.edu for any material requests or questions.


Supported processes

The CEE 200X has recipes in 1000 rpm increments from 1000 to 5000 rpm for each of the equipped photoresists as well as for manual dispensed photoresists. There are recipes for pieces larger than 15 mm, 100 mm wafers and 150 mm wafers. The primary difference between theses recipes is how much photoresist is dispensed.

Details for the available recipes can be found in the following tables. These include average thicknesses expected using the automatic dispense recipes as well as examples for bake times, exposure values, and develop times. These parameters may vary for individual processes.

SPR 220 (3.0)
Spin Speed Thickness Softbake Stepper Exposure Contact Aligner Exposure Post Exposure Bake Puddle Develop Time
1000 rpm 4.6 µm 115°C for 90 sec 0.35 sec ? 115°C for 90 sec AZ 726 DP 70-70
2000 rpm 3.2 µm 115°C for 90 sec 0.33 sec ? 115°C for 90 sec AZ 726 DP 60-60
3000 rpm 2.5 µm 115°C for 90 sec 0.32 sec ? 115°C for 90 sec AZ 726 DP 40-40
4000 rpm 2.2 µm 115°C for 90 sec 0.25 sec ? 115°C for 90 sec AZ 726 DP 60
5000 rpm 1.9 µm 115°C for 90 sec 0.25 sec ? 115°C for 90 sec AZ 726 DP 60


SPR 220 (7.0)
Spin Speed Thickness Softbake Stepper Exposure Contact Aligner Exposure Post Exposure Bake Puddle Develop Time
1000 rpm 15 µm 115°C for 90 sec ? ? 115°C for 90 sec ?
2000 rpm 10 µm 115°C for 90 sec ? ? 115°C for 90 sec ?
3000 rpm 7.6 µm 115°C for 90 sec ? ? 115°C for 90 sec ?
4000 rpm 7.0 µm 115°C for 90 sec ? ? 115°C for 90 sec ?
5000 rpm 6.4 µm 115°C for 90 sec ? ? 115°C for 90 sec ?

Standard operating procedure

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Checkout procedure

  1. Complete a Lithography training session. If you have already completed this for another tool, you do not need to complete it again.
  2. Read this page and the SOP.
  3. Take the quiz found here.
  4. Create a ticket asking for authorization.

A staff member will verify the correctness of your quiz response and schedule a brief checkout session before authorizing you.

Maintenance

Photoresist levels are checked several times a week and replaced when low. The bowls and chucks are cleaned each week during lab clean.

User authorized maintenance

In the event of a power bump, users may run the startup/shutdown procedure.