CEE 200X photoresist spinner 2

CEE 200X photoresist spinner 2
Equipment Details
Technology	Lithography
Materials Restriction	Metals
Material Processed	SPR 220 (3.0) 1813
Sample Size	pieces up to 6" wafers
Equipment Manual
Overview	System Overview
Operating Procedure	SOP
Supported Processes	Supported Processes
Maintenance	Maintenance

The CEE 200X photoresist spinner 2 is a fully programmable, automatic dispense, photoresist spinner located in 1440C. It can accept pieces, 4" and 6" wafers. It has automatic photoresist dispensers, but can also accommodate manual dispensing.

Announcements

• None at this time.

Capabilities

Equipped Photoresists: SPR 220 (3.0), 1813

SU-8 must be processed in the ROBIN lab

PMMA and other e-beam resists should be processed in Photoresist Bench 31

LOR should be processed in the CEE 100CB photoresist spinner

For all other materials, please contact staff to request approval

System overview

Hardware details

• Up to 6K rpm spin rates
• Hot plate up to 200°C
• Photoresist is dispensed automatically with an equipped photoresist or through an EFD tube.

Substrate requirements

• 1x1 cm pieces up to 6" wafers
• No substrate material requirements
• Available Chucks
  • 6" Chuck (Ø 3.75")
  • 4" Chuck (Ø 2.25")
  • Large Piece Chuck (Ø 0.75")
  • Small Piece Chuck (Ø 0.25" - chuck ; Ø 0.375" - O-ring)

Material restrictions

The CEE 200X photoresist spinner 2 is designated as a Metals class tool. Below is a list of approved materials for the tool. Approved means the material is allowed in the tool under normal circumstances. If a material is not listed, please create a helpdesk ticket or email info@lnf.umich.edu for any material requests or questions.

Approved materials

Supported processes

The CEE 200X has recipes in 1000 rpm increments from 1000 to 5000 rpm for each of the equipped photoresists as well as for manual dispensed photoresists. There are recipes for pieces larger than 15 mm, 100 mm wafers and 150 mm wafers. The primary difference between theses recipes is how much photoresist is dispensed.

Details for the available recipes can be found in the following tables. These include average thicknesses expected using the automatic dispense recipes as well as examples for bake times, exposure values, and develop times. These parameters may vary for individual processes.

SPR 220 (3.0)
Spin Speed	Thickness	Softbake	Stepper Exposure	Contact Aligner Exposure	Post Exposure Bake	Puddle Develop Time
1000 rpm	4.6 µm	115°C for 90 sec	0.35 sec	?	115°C for 90 sec	AZ 726 DP 70-70
2000 rpm	3.2 µm	115°C for 90 sec	0.33 sec	?	115°C for 90 sec	AZ 726 DP 60-60
3000 rpm	2.5 µm	115°C for 90 sec	0.32 sec	?	115°C for 90 sec	AZ 726 DP 40-40
4000 rpm	2.2 µm	115°C for 90 sec	0.25 sec	?	115°C for 90 sec	AZ 726 DP 60
5000 rpm	1.9 µm	115°C for 90 sec	0.25 sec	?	115°C for 90 sec	AZ 726 DP 60

1813
Spin Speed	Thickness	Softbake	Stepper Exposure	Contact Aligner Exposure	Post Exposure Bake	Puddle Develop Time
1000 rpm	2.8 µm	115°C for 60 sec	?	?	None	?
2000 rpm	2.0 µm	115°C for 60 sec	.35	?	None	AZ 726 SP 60
3000 rpm	1.6 µm	115°C for 60 sec	?	?	None	?
4000 rpm	1.4 µm	115°C for 60 sec	?	?	None	AZ 726 SP 30
5000 rpm	1.2 µm	115°C for 60 sec	?	?	None	?

1827
Spin Speed	Thickness	Softbake	Stepper Exposure	Contact Aligner Exposure	Post Exposure Bake	Puddle Develop Time
1000 rpm	6.0 µm	115°C for 60 sec	?	?	None	?
2000 rpm	4.1 µm	115°C for 60 sec	?	?	None	?
3000 rpm	3.3 µm	115°C for 60 sec	?	?	None	?
4000 rpm	2.8 µm	115°C for 60 sec	?	?	None	?
5000 rpm	2.5 µm	115°C for 60 sec	?	?	None	?

Standard operating procedure

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Checkout procedure

1. Complete a Lithography training session. If you have already completed this for another tool, you do not need to complete it again.
2. Practice on the tool with your mentor
3. Read this page and the SOP.
4. Take the quiz found here.
5. Create a ticket asking for a checkout.
6. A tool engineer will schedule a time for a checkout. If this checkout is successful, the engineer will authorize you on the tool.

Maintenance

Photoresist levels are checked several times a week and replaced when low. The bowls and chucks are cleaned each week during lab clean.

User authorized maintenance

In the event of a power bump, users may run the startup/shutdown procedure.