CEE Developer 1

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Left #1, Right #2

The CEE Developers are used to develop photoresist after it's been exposed to UV light by forming a puddle of developer on the wafer. They can accept pieces, 4" and 6" wafers as well as 4", 5" and 7" mask plates. Due to their automation, they are well suited for high repeatability in puddle developing of standard photoresist. They are located in 1440C across from the [CEE 200X PR Spinner 1|CEE 200X PR Spinners].



Both spinners are fully operational and ready for processing. For day to day shutdowns please consult the helpdesk system on the scheduler.

System Overview

The CEE 200X puddle developers are fully programmable, automatic dispense, puddle develop spinners located in 1440C in LNF. They use a vacuum chuck to hold samples during the spin. This vacuum is transmitted through a hole in the spindle. In order to operate they must sense vacuum on the back side of the wafer and also have the lid closed. Since fresh developer is used for every wafer and the develop time is controlled by the tool, it is easy to get repeatable results. Only a small amount (~10ml) of developer is used per sample, making them much more cost effective compared to beaker developing.

Tool Capabilities/Limitations

  • Available Developers (Only metal ion free developers are allowed on these tools)
    • AZ 726
    • CD 30 [CEE Developer 2|Only on CEE Developer #2]
  • Photoresists that may be developed
    • [1800 Series]
    • [SPR 220]
    • [KMPR]
  • Hardware Details
    • Up to 6K rpm spin rates
    • Two auto-dispense developers per station

Substrate Requirements

[imageright|Correct chuck for sample|{UP(Public.CEE 200X PR Spinner 1)}Correct Chuck.jpg] [imageright|Incorrect chuck for sample - a smaller <br>chuck should be used|{UP(Public.CEE 200X PR Spinner 1)}Incorrect Chuck.jpg]

  • Sample size range
    • Pieces larger then 10 mm
    • 4" round
    • 6"round
    • 4" square
    • 5" square
    • 7" square
    • No known thickness limitations

Four different size chucks for wafers are available and three for mask plates. Please choose a chuck sized appropriately for your sample. Your sample must fully cover the top surface of the chuck, this is to prevent developer from being sucked into the vacuum hole. To the right is an example of a sample that fully covers the chuck and an example of a sample that doesn't fully cover the chuck. The tools may be damaged if developer goes into the vacuum hole in the spindle, therefore users may lose access to the tool if their sample doesn't fully cover the chuck.

Supported Recipes/Processes

  • Currently single and double puddle recipes exist using AZ726 developer at 20 second increments
    • 40-40 double puddle is recommended for 3um thick SPR220
    • 70-70 double puddle is recommended for 5um thick SPR220

For more recipe info please see the [CEE 200X PR Spinner 1|CEE 200X PR Spinners supported recipes]

Please read the [Lithography Handbook] for more information on developing and other lithography processing.


  1. Enable the tool on the Scheduler
  2. If necessary log on, the password is CEE
  3. If necessary change the chuck so that the wafer fully covers the chuck surface
  4. Load a wafer
  5. Turn the chuck vacuum on by pressing Hold
  6. Close the lid
  7. Select the recipe to run (click Run then select the recipe)
  8. Press Ok then Start Centering
  9. Check that the wafer is centered and press Start Recipe
  10. After the process is completed very Gently open the lid to prevent water from falling on the wafer
  11. Clean the workstation
    1. Throw all soiled wipes in the base waste
  12. Fill out the logbook

For detailed operating instructions, read the [^{UP(Public.CEE Developer 1)}CEE Developer SOP.pdf|CEE Developer SOP].

Tool Checkout Procedure

  1. Complete a [Lithography Training Session]. If you have already completed this for another tool, you do not need to complete it again.
  2. Read the [^{UP(Public.CEE Developer 1)}CEE Developer SOP.pdf|CEE Developer SOP]
  3. Take the quiz found [1]
  4. Create a ticket asking for authorization
  5. Attend a brief training session with one of the tool engineers

A staff member will verify the correctness of your quiz response and authorize you on the tool.

Common Issues

Wafer Not Present:

  • Occasionally if you start the process without first turning on the chuck vacuum you will get this error even if you are using the right size chuck and it's properly seated. It means that the tool isn't sensing adequate vacuum behind the wafer. It can take a second for vacuum to develop behind the wafer, so it is usually better to first manually turn the vacuum on by pressing Hold then running the job once it senses that the wafer is there.
  • This can also mean that the vacuum sensor has failed and is no longer detecting vacuum. If this happens please make a helpdesk ticket.

Wafer Not Present During Operation: If the tool stops mid process (usually when it ramps up speed after it washes the developer off) and gives a wafer not present error, either the wafer isn't seated well or the vacuum sensor needs adjustment. If this happens please make a helpdesk ticket.

Developer Not Dispensing: Rarely the developer can run out. If the tool isn't dispensing developer please make a help desk ticket.

Developer Didn't Hit My Sample: Someone may have bumped the nozzle out of alignment, feel free to make a help desk ticket and a staff member will re-align the dispense nozzle.