Difference between revisions of "CEE Developer 2"

From LNF Wiki
Jump to navigation Jump to search
 
(17 intermediate revisions by 3 users not shown)
Line 24: Line 24:
 
==Capabilities==
 
==Capabilities==
 
*Can develop most common photoresists
 
*Can develop most common photoresists
−
** [[SPR 220 (3.0)]]
+
 
−
** [[SPR 220 (7.0)]]
+
*Can develop most common photoresists
−
** [[Shipley 1813]]
+
**[[SPR 220|SPR 220 (3.0)]]
−
** [[Shipley 1827]]
+
**[[SPR 220 7.0|SPR 220 (7.0)]]
−
** [[KMPR 1010]]
+
**[[Shipley 1813]]
−
** [[KMPR 1025]]
+
**[[AZ 12XT]]
 +
**[[KMPR 1010]]
 +
**[[KMPR 1025]]
  
 
==System Overview==
 
==System Overview==
 
===Hardware Details===
 
===Hardware Details===
−
{{disputed-section}}
 
 
* Available developer
 
* Available developer
 
** [[AZ 726]]
 
** [[AZ 726]]
−
** [[CD-30]]
+
** [[Microposit developer concentrate]]
 
* Spindle
 
* Spindle
 
** 6000 rpm max speed
 
** 6000 rpm max speed
Line 42: Line 43:
  
 
===Substrate Requirements===
 
===Substrate Requirements===
 +
* Pieces up to 2", pieces smaller than 10mm must be mounted
 
* 4" wafer
 
* 4" wafer
 
* 6" wafer
 
* 6" wafer
−
* Pieces
 
 
* 4" mask
 
* 4" mask
 
* 5" mask
 
* 5" mask
−
* 7" mask
 
  
 
===Material Restrictions===
 
===Material Restrictions===
Line 53: Line 53:
  
 
==Supported Processes==
 
==Supported Processes==
−
{{Disputed-section|Fake data}}
+
The CEE Developer has several recipes available for pieces, 4" and 6" wafers from 10 sec to 160 sec in 10 sec increments.  These exist in single puddle (SP) and double puddle (DP).  A single puddle dispenses 1 puddle of developer onto the wafer, where as the double puddle adds a second puddle of fresh developer half way through the develop.  The recipe name is in a ''developer_size_SP/DP_time'' format.  The size dictates how much developer it dispenses, and the time is in seconds.   
−
The CEE Developer has several recipes available for pieces, 4" and 6" wafers from 10 sec to 160 sec in 10 sec increments.  These exist in single puddle (SP) and double puddle (DP).  A single puddle dispenses 1 puddle of developer onto the wafer, where as the double puddle adds a second puddle of fresh developer half way through the develop.  The recipe name is in a ''size_developer_SP/DP_time'' format.  The size dictates how much developer it dispenses, and the time is in seconds.  Recipes also exist for developing mask plates exposed on the [[Heidelberg Mask Maker]]. For more process information please see the specific photoresist page ([[SPR 220]], [[1800]], [[KMPR]]).
+
[[File:CEE_Developer_recipe_name_format.png|frame|CEE Developer recipe name format]]
−
 
 
−
===SPR 220===
 
−
{| class="wikitable" border="1"
 
−
! rowspan="2"|Spin Speed
 
−
! colspan="2"|SPR 220 (3.0)
 
−
! colspan="2"|SPR 220 (7.0)
 
−
|-
 
−
! Thickness
 
−
! Recipe
 
−
! Thickness
 
−
! Recipe
 
−
|-
 
−
| 875 rpm
 
−
| 5.0 μm
 
−
| 80-80 DP
 
−
| 5.0 μm
 
−
| 80-80 DP
 
−
|-
 
−
| 1000 rpm
 
−
| 5.0 μm
 
−
| 70-70 DP
 
−
| 5.0 μm
 
−
| 70-70 DP
 
−
|-
 
−
| 2000 rpm
 
−
| 5.0 μm
 
−
| 40-40 DP
 
−
| 5.0 μm
 
−
| 40-40 DP
 
−
|-
 
−
| 3000 rpm
 
−
| 5.0 μm
 
−
| 30-30 DP
 
−
| 5.0 μm
 
−
| 30-30 DP
 
−
|-
 
−
| 4000 rpm
 
−
| 5.0 μm
 
−
| 60 SP
 
−
| 5.0 μm
 
−
| 60 SP
 
−
|-
 
−
| 5000 rpm
 
−
| 5.0 μm
 
−
| 60 SP
 
−
| 5.0 μm
 
−
| 60 SP
 
−
|}
 
−
 
 
  
−
===1800===
 
−
{| class="wikitable" border="1"
 
−
! rowspan="2"|Spin Speed
 
−
! colspan="2"|1813
 
−
! colspan="2"|1827
 
−
|-
 
−
! Thickness
 
−
! Recipe
 
−
! Thickness
 
−
! Recipe
 
−
|-
 
−
| 875 rpm
 
−
| 5.0 μm
 
−
| 80-80 DP
 
−
| 5.0 μm
 
−
| 80-80 DP
 
−
|-
 
−
| 1000 rpm
 
−
| 5.0 μm
 
−
| 70-70 DP
 
−
| 5.0 μm
 
−
| 70-70 DP
 
−
|-
 
−
| 2000 rpm
 
−
| 5.0 μm
 
−
| 40-40 DP
 
−
| 5.0 μm
 
−
| 40-40 DP
 
−
|-
 
−
| 3000 rpm
 
−
| 5.0 μm
 
−
| 30-30 DP
 
−
| 5.0 μm
 
−
| 30-30 DP
 
−
|-
 
−
| 4000 rpm
 
−
| 5.0 μm
 
−
| 60 SP
 
−
| 5.0 μm
 
−
| 60 SP
 
−
|-
 
−
| 5000 rpm
 
−
| 5.0 μm
 
−
| 60 SP
 
−
| 5.0 μm
 
−
| 60 SP
 
−
|}
 
  
−
===KMPR===
+
Recipes also exist for developing mask plates exposed on the [[Heidelberg Mask Maker]].  For more process information please see the specific photoresist page ([[SPR 220]], [[1800]], [[KMPR]]).
−
{| class="wikitable" border="1"
 
−
! rowspan="2"|Spin Speed
 
−
! colspan="2"|KMPR 1010
 
−
! colspan="2"|KMPR 1025
 
−
|-
 
−
! Thickness
 
−
! Recipe
 
−
! Thickness
 
−
! Recipe
 
−
|-
 
−
| 1000 rpm
 
−
| 5.0 μm
 
−
| 70-70 DP
 
−
| 5.0 μm
 
−
| 70-70 DP
 
−
|-
 
−
| 3000 rpm
 
−
| 5.0 μm
 
−
| 30-30 DP
 
−
| 5.0 μm
 
−
| 30-30 DP
 
−
|-
 
−
| 5000 rpm
 
−
| 5.0 μm
 
−
| 60 SP
 
−
| 5.0 μm
 
−
| 60 SP
 
−
|}
 
  
 
==Standard Operating Procedure==
 
==Standard Operating Procedure==
−
{{external links|section}}
 
 
<!-- To include a document from google docs, use the line below, replace "googledocid" with the ID for the document. Remember, to make this visible, you must set Sharing for the document to "Anyone with the link can view". -->
 
<!-- To include a document from google docs, use the line below, replace "googledocid" with the ID for the document. Remember, to make this visible, you must set Sharing for the document to "Anyone with the link can view". -->
−
{{#widget:GoogleDoc|key=19D0SN6CwISK1PGf7cZy4mSjzBd8dfTQXikVLHpGVTjQ}}
+
{{#widget:GoogleDoc|key=1QTatbwww3j-f8_UBLg_mqrFVbpxG-xK1l84cLVuyb6M}}
  
 
==Checkout Procedure==
 
==Checkout Procedure==
−
<!-- Describe the checkout procedure for the tool. For example: -->
+
 
 
# Complete a [[Lithography training session]]. If you have already completed this for another tool, you do not need to complete it again.
 
# Complete a [[Lithography training session]]. If you have already completed this for another tool, you do not need to complete it again.
−
# Read through this page and the [https://docs.google.com/document/d/19D0SN6CwISK1PGf7cZy4mSjzBd8dfTQXikVLHpGVTjQ/preview Standard Operating Procedure] above.
+
# Practice on the tool with your mentor.
−
# Complete the SOP quiz [https://docs.google.com/a/lnf.umich.edu/forms/d/1FWiaXW08zj5mVli_DmQVQsafimG8FpjhqLiYKvF8Aow/viewform?formkey=dDM5OXpqQ25XTGNLUU9lY2p4eHZncUE6MQ#gid=0 here].
+
# Read through the User Manual above.
−
# Create a [http://ssel-sched.eecs.umich.edu/sselScheduler/ResourceContact.aspx?tabindex=3&path=0:0:0:{{#var:toolid}} Helpdesk Ticket] requesting checkout.
+
# Accurately complete the [https://forms.gle/uDMSjD9GKcmnECFY9 checkout quiz]. You may retake as necessary until all answers are correct.
−
# A tool engineer will schedule a time for a checkout. If this checkout is successful, the engineer will authorize you on the tool.
+
# Schedule a time for a checkout:
 +
## Find an available time for checkout [https://calendly.com/lnf-lithography/cee-spinners here].
 +
## Verify that the tool is available in the [https://ssel-sched.eecs.umich.edu/sselscheduler/ResourceDayWeek.aspx?Path=0-0-0-{{#var:toolid}} LNF Online Services] at the time you are requesting.
 +
## After confirmation that the event is scheduled in Calendly, invite the staff member assigned to your event to a Staff Support reservation at that time.
 +
# Create a [http://ssel-sched.eecs.umich.edu/sselScheduler/ResourceContact.aspx?tabindex=3&path=0:0:0:{{#var:toolid}} helpdesk ticket] for final confirmation of your checkout appointment.
 +
# Authorization will be provided pending demonstration of proper tool use in the presence of a tool engineer.
  
 
==Maintenance==  
 
==Maintenance==  
 
Twice a week during lab clean the CEE's are cleaned and organized.  Also the vacuum fluid trap is routinely emptied.
 
Twice a week during lab clean the CEE's are cleaned and organized.  Also the vacuum fluid trap is routinely emptied.

Latest revision as of 10:47, 3 December 2021


CEE Developer 2
53091.jpg
CEE Developer Table
Equipment Details
Technology Lithography
Materials Restriction Metals
Material Processed Photoresist
Sample Size

6", 4", pieces, 5" masks,

4" masks
Chemicals Used AZ 726, CD-30
Equipment Manual
Overview Overview
Operating Procedure SOP
Supported Processes Supported Processes
Maintenance Maintenance[CD-30]]


The CEE Developers are used to develop photoresist after it's been exposed to UV light by forming a puddle of developer on the wafer. They can accept pieces, 4" and 6" wafers as well as 4", 5" and 7" mask plates. Due to their automation, they are well suited for highly repeatable puddle developing of photoresist. They are located in 1440C across from the CEE 200X PR Spinners.

Announcements

  • None at this time.

Capabilities

  • Can develop most common photoresists

System Overview

Hardware Details

Substrate Requirements

  • Pieces up to 2", pieces smaller than 10mm must be mounted
  • 4" wafer
  • 6" wafer
  • 4" mask
  • 5" mask

Material Restrictions

The CEE Developer 2 is designated as a Metals class tool. Below is a list of approved materials for the tool. Approved means the material is allowed in the tool under normal circumstances. If a material is not listed, please create a helpdesk ticket or email info@lnf.umich.edu for any material requests or questions.

Approved materials


Supported Processes

The CEE Developer has several recipes available for pieces, 4" and 6" wafers from 10 sec to 160 sec in 10 sec increments. These exist in single puddle (SP) and double puddle (DP). A single puddle dispenses 1 puddle of developer onto the wafer, where as the double puddle adds a second puddle of fresh developer half way through the develop. The recipe name is in a developer_size_SP/DP_time format. The size dictates how much developer it dispenses, and the time is in seconds.

CEE Developer recipe name format


Recipes also exist for developing mask plates exposed on the Heidelberg Mask Maker. For more process information please see the specific photoresist page (SPR 220, 1800, KMPR).

Standard Operating Procedure

Widget text will go here.

Checkout Procedure

  1. Complete a Lithography training session. If you have already completed this for another tool, you do not need to complete it again.
  2. Practice on the tool with your mentor.
  3. Read through the User Manual above.
  4. Accurately complete the checkout quiz. You may retake as necessary until all answers are correct.
  5. Schedule a time for a checkout:
    1. Find an available time for checkout here.
    2. Verify that the tool is available in the LNF Online Services at the time you are requesting.
    3. After confirmation that the event is scheduled in Calendly, invite the staff member assigned to your event to a Staff Support reservation at that time.
  6. Create a helpdesk ticket for final confirmation of your checkout appointment.
  7. Authorization will be provided pending demonstration of proper tool use in the presence of a tool engineer.

Maintenance

Twice a week during lab clean the CEE's are cleaned and organized. Also the vacuum fluid trap is routinely emptied.

Retrieved from "https://lnf-wiki.eecs.umich.edu/wiki/index.php?title=CEE_Developer_2&oldid=21216"