Difference between revisions of "CEE Developer 2"

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==Supported Processes==
 
==Supported Processes==
 
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The CEE Developer has several recipes available for pieces, 4" and 6" wafers from 10 sec to 160 sec in 10 sec increments.  These exist in single puddle (SP) and double puddle (DP).  A single puddle dispenses 1 puddle of developer onto the wafer, where as the double puddle adds a second puddle of fresh developer half way through the develop.  The recipe name is in a ''size_developer_SP/DP_time'' format.  The size dictates how much developer it dispenses, and the time is in seconds.  Recipes also exist for developing mask plates exposed on the [[Heidelberg Mask Maker]].  For more process information please see the specific photoresist page ([[SPR 220]], [[1800]], [[KMPR]]).
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The CEE Developer has several recipes available for pieces, 4" and 6" wafers from 10 sec to 160 sec in 10 sec increments.  These exist in single puddle (SP) and double puddle (DP).  A single puddle dispenses 1 puddle of developer onto the wafer, where as the double puddle adds a second puddle of fresh developer half way through the develop.  The recipe name is in a ''size_developer_SP/DP_time'' format.  The size dictates how much developer it dispenses, and the time is in seconds.   
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[[File:CEE_Developer_recipe_name_format.png|frame|CEE Developer recipe name format]]
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Recipes also exist for developing mask plates exposed on the [[Heidelberg Mask Maker]].  For more process information please see the specific photoresist page ([[SPR 220]], [[1800]], [[KMPR]]).
  
 
===SPR 220===
 
===SPR 220===

Revision as of 14:15, 3 August 2015


CEE Developer 2
53091.jpg
CEE Developer Table
Equipment Details
Technology Lithography
Materials Restriction Metals
Material Processed Photoresist
Sample Size

6", 4", pieces, 5" masks,

4" masks
Chemicals Used AZ 726, CD-30
Equipment Manual
Overview Overview
Operating Procedure SOP
Supported Processes Supported Processes
Maintenance Maintenance[CD-30]]


The CEE Developers are used to develop photoresist after it's been exposed to UV light by forming a puddle of developer on the wafer. They can accept pieces, 4" and 6" wafers as well as 4", 5" and 7" mask plates. Due to their automation, they are well suited for highly repeatable puddle developing of photoresist. They are located in 1440C across from the CEE 200X PR Spinners.

Announcements

  • None at this time.

Capabilities

System Overview

Hardware Details

  • Available developer
  • Spindle
    • 6000 rpm max speed
    • Servo controlled

Substrate Requirements

  • 4" wafer
  • 6" wafer
  • Pieces
  • 4" mask
  • 5" mask
  • 7" mask

Material Restrictions

The CEE Developer 2 is designated as a Metals class tool. Below is a list of approved materials for the tool. Approved means the material is allowed in the tool under normal circumstances. If a material is not listed, please create a helpdesk ticket or email info@lnf.umich.edu for any material requests or questions.


Supported Processes

The CEE Developer has several recipes available for pieces, 4" and 6" wafers from 10 sec to 160 sec in 10 sec increments. These exist in single puddle (SP) and double puddle (DP). A single puddle dispenses 1 puddle of developer onto the wafer, where as the double puddle adds a second puddle of fresh developer half way through the develop. The recipe name is in a size_developer_SP/DP_time format. The size dictates how much developer it dispenses, and the time is in seconds.

CEE Developer recipe name format


Recipes also exist for developing mask plates exposed on the Heidelberg Mask Maker. For more process information please see the specific photoresist page (SPR 220, 1800, KMPR).

SPR 220

Spin Speed SPR 220 (3.0) SPR 220 (7.0)
Thickness Recipe Thickness Recipe
875 rpm 5.0 μm 80-80 DP 5.0 μm 80-80 DP
1000 rpm 5.0 μm 70-70 DP 5.0 μm 70-70 DP
2000 rpm 5.0 μm 40-40 DP 5.0 μm 40-40 DP
3000 rpm 5.0 μm 30-30 DP 5.0 μm 30-30 DP
4000 rpm 5.0 μm 60 SP 5.0 μm 60 SP
5000 rpm 5.0 μm 60 SP 5.0 μm 60 SP


1800

Spin Speed 1813 1827
Thickness Recipe Thickness Recipe
875 rpm 5.0 μm 80-80 DP 5.0 μm 80-80 DP
1000 rpm 5.0 μm 70-70 DP 5.0 μm 70-70 DP
2000 rpm 5.0 μm 40-40 DP 5.0 μm 40-40 DP
3000 rpm 5.0 μm 30-30 DP 5.0 μm 30-30 DP
4000 rpm 5.0 μm 60 SP 5.0 μm 60 SP
5000 rpm 5.0 μm 60 SP 5.0 μm 60 SP

KMPR

Spin Speed KMPR 1010 KMPR 1025
Thickness Recipe Thickness Recipe
1000 rpm 5.0 μm 70-70 DP 5.0 μm 70-70 DP
3000 rpm 5.0 μm 30-30 DP 5.0 μm 30-30 DP
5000 rpm 5.0 μm 60 SP 5.0 μm 60 SP

Standard Operating Procedure

Widget text will go here.

Checkout Procedure

  1. Complete a Lithography training session. If you have already completed this for another tool, you do not need to complete it again.
  2. Read through this page and the Standard Operating Procedure above.
  3. Complete the SOP quiz here.
  4. Create a Helpdesk Ticket requesting checkout.
  5. A tool engineer will schedule a time for a checkout. If this checkout is successful, the engineer will authorize you on the tool.

Maintenance

Twice a week during lab clean the CEE's are cleaned and organized. Also the vacuum fluid trap is routinely emptied.