View source for CL200 Megasonic Cleaner

{{#vardefine:toolid| 142001}} {{#vardefine:technology|Wafer bonding}} [[Category: Substrate cleaning equipment]] {{#vardefine:restriction|3}}
{{infobox equipment
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|overview = [https://docs.google.com/document/d/1pOoP13UPKri1Lh8XS_Ul5NLVPajfeQORnpwgbMBEg_I/preview System Overview]
|sop = [https://docs.google.com/document/d/1y0EMKtXPokTYSYPHUcsfN99zQC2YMSEcmbQuF80miVM/preview SOP]
|processes = [[{{PAGENAME}}/Processes|Supported Processes]]
|userprocesses = [[LNF_User:{{PAGENAME}}_User_Processes|User Processes]]
|maintenance = [[{{PAGENAME}}#Maintenance | Maintenance]]
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The CL200 Megasonic Cleaner is a [[Cleaning|substrate cleaner]] that can process 100 mm or 150 mm wafers.  It uses either DI with a megasonic action to clean the wafers.  The tool then dries the wafers via spinning with IR heating.  Wafers should be cleaned in this tool before going into a bonder such as the [[EVG 520IS]] or [[SB-6E Bonder]] to reduce particulate.