Difference between revisions of "CL200 Megasonic Cleaner"

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The CL200 Megasonic Cleaner is a [[Cleaning|substrate cleaner]] that can process 100 mm or 150 mm wafers.  It uses either DI or an [[RCA clean]] with a megasonic action to clean the wafers.  The tool then dries the wafers via spinning with IR heating.  Wafers should be cleaned in this tool before going into a bonder such as the [[EVG 520IS]] or [[SB-6E Bonder]] to reduce particulate.
 
The CL200 Megasonic Cleaner is a [[Cleaning|substrate cleaner]] that can process 100 mm or 150 mm wafers.  It uses either DI or an [[RCA clean]] with a megasonic action to clean the wafers.  The tool then dries the wafers via spinning with IR heating.  Wafers should be cleaned in this tool before going into a bonder such as the [[EVG 520IS]] or [[SB-6E Bonder]] to reduce particulate.
  
==Announcements==
 
* [2014-07-01] [[JTB 100 Wafer Clean]] added to tool.
 
  
 
==Capabilities==
 
==Capabilities==

Revision as of 09:20, 10 March 2022

CL200 Megasonic Cleaner
142001.jpg
Equipment Details
Technology Wafer bonding
Materials Restriction Metals
Equipment Manual
Overview System Overview
Operating Procedure SOP
Supported Processes Supported Processes
User Processes User Processes
Maintenance Maintenance


The CL200 Megasonic Cleaner is a substrate cleaner that can process 100 mm or 150 mm wafers. It uses either DI or an RCA clean with a megasonic action to clean the wafers. The tool then dries the wafers via spinning with IR heating. Wafers should be cleaned in this tool before going into a bonder such as the EVG 520IS or SB-6E Bonder to reduce particulate.


Capabilities

System Overview

Hardware Details

  • 3000 RPM drive
  • IR heating to dry off wafers
  • Vibratory motor to align wafers

Substrate Requirements

  • Primarily 100 mm
    • Can be converted to 150 mm

Material Restrictions

The CL200 Megasonic Cleaner is designated as a Metals class tool. Below is a list of approved materials for the tool. Approved means the material is allowed in the tool under normal circumstances. If a material is not listed, please create a helpdesk ticket or email info@lnf.umich.edu for any material requests or questions.


Supported Processes

The CL200 has standard recipes for a megasonic clean with only DI or with DI and JTB 100. The main editable parameters are the number of scans, number of cycles, and the spin speed.

Recipe DI JTB-100 Comments
4in Clean Single Wafer Yes No A general purpose clean for 100 mm wafers
4in RCA Clean Single Wafer Yes Yes A general purpose JTB-100 clean for 100 mm wafers
6in Clean Single Wafer Yes No A general purpose clean for 150 mm wafers
6in RCA Clean Single Wafer Yes Yes A general purpose JTB-100 clean for 150 mm wafers

Standard Operating Procedure

Widget text will go here.

Checkout Procedure

  1. Read through this page and the Standard Operating Procedure above.
  2. Create a Helpdesk Ticket requesting training.
  3. A tool engineer will schedule a time for initial training.
  4. Practice with your mentor or another authorized user until you are comfortable with tool operation.
  5. Schedule a checkout session with a tool engineer via the helpdesk ticket system. If this checkout is successful, the engineer will authorize you on the tool.

Maintenance

Once a month the chamber is inspected and cleaned.