CL200 Megasonic Cleaner

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CL200 Megasonic Cleaner
Equipment Details
Technology Wafer bonding
Materials Restriction Metals
Equipment Manual
Overview System Overview
Operating Procedure SOP
Supported Processes Supported Processes
User Processes User Processes
Maintenance Maintenance

The CL200 Megasonic Cleaner is a substrate cleaner that can process 100 mm or 150 mm wafers. It uses either DI with a megasonic action to clean the wafers. The tool then dries the wafers via spinning with IR heating. Wafers should be cleaned in this tool before going into a bonder such as the EVG 520IS or SB-6E Bonder to reduce particulate.


  • Remove particulate from wafers

System Overview

Hardware Details

  • 3000 RPM drive
  • IR heating to dry off wafers
  • Vibratory motor to align wafers

Substrate Requirements

  • Primarily 100 mm
    • Can be converted to 150 mm

Material Restrictions

The CL200 Megasonic Cleaner is designated as a Metals class tool. Below is a list of approved materials for the tool. Approved means the material is allowed in the tool under normal circumstances. If a material is not listed, please create a helpdesk ticket or email for any material requests or questions.

Supported Processes

The CL200 has standard recipes for a megasonic clean with DI. The main editable parameters are the number of scans, number of cycles, and the spin speed.

Recipe DI JTB-100 Comments
4in Clean Single Wafer Yes No A general purpose clean for 100 mm wafers
4in RCA Clean Single Wafer Yes Yes A general purpose JTB-100 clean for 100 mm wafers
6in Clean Single Wafer Yes No A general purpose clean for 150 mm wafers
6in RCA Clean Single Wafer Yes Yes A general purpose JTB-100 clean for 150 mm wafers

Standard Operating Procedure

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Checkout Procedure

  1. Read through this page and the Standard Operating Procedure above.
  2. Practice with your mentor or another authorized user until you are comfortable with tool operation. If your mentor is not an authorized user or you do not know of an authorized user that can train you, proceed to the next step.
  3. Create a Helpdesk Ticket requesting training.
  4. A tool engineer will schedule a time for initial training.
  5. Schedule a checkout session with a tool engineer via the helpdesk ticket system. If this checkout is successful, the engineer will authorize you on the tool.


Once a month the chamber is inspected and cleaned.