Difference between revisions of "CMP Strasbaugh 6EC"

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===Substrate requirements===
 
===Substrate requirements===
 
* 4", 6", mounted pieces on carrier
 
* 4", 6", mounted pieces on carrier
* Carrier can be a blank wafer or
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* Carrier can be a blank wafer
 
<!--|* Any mounting?
 
<!--|* Any mounting?
 
     * Wafer thickness
 
     * Wafer thickness

Revision as of 07:05, 26 July 2018

CMP Strasbaugh 6EC
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Strasbaugh 6ec
Equipment Details
Technology Polishing
Materials Restriction Metals
Material Processed Dielectrics, some metals
Mask Materials n/a
Sample Size 4", 6" and pieces
Chemicals Used Slurries for above materials
Gases Used n/a
Equipment Manual
Overview System Overview[CMP Strasbaugh 6EC#Material_Restrictions|Metals]]
Operating Procedure SOP
Supported Processes Supported Processes
Maintenance Maintenance


The CMP Strasbaugh 6EC is a single-wafer planarizer designed for the research and development environment. This CMP has both 4" and 6" capabilities, VIPRR wafer carrier, in-situ pad conditioner, and interchangeable platens to accommodate different processes. Standard processes include dielectric planarizing. One of the platens is exclusively dedicated to lapping. Capabilities for lapping/polishing of pieces, thick samples up to 4mm, and III-V materials also exist. Metal polishing capabilities are being developed

Announcements

Change in the Silicon Slurry - The Cabot slurry is not available anymore. The Ultra-Sol® 558 is the new slurry that should be used instead. Staff will evaluate this slurry and include removal rates in SOP and wiki.

Capabilities

  • Polish and thinning pieces, 4" and 6" wafers
  • Standard processes for Si, SiO2
  • Up to 3 mm thick samples
  • GaAs, polishing capability, or other III-V
  • Can collect hazardous waste
  • Polish quartz.
  • Polish single or double wafers
  • Exchangeable platens
  • Lapping pad: 3 μm and 5μm

System overview

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Hardware details

  • Multiple platens
  • Drain diverter that allows polishing and lapping of materials not permitted into waste water stream
  • Polishing Pad Rohm and Haas IC1000
  • Lapping pad: 3M Trizact (3 micron grit, 6 micron grit available)
  • In-situ or ex-situ pad conditioning
  • Diamond disk pad conditioner
  • VIPPR chuck and hydroload

Substrate requirements

  • 4", 6", mounted pieces on carrier
  • Carrier can be a blank wafer

Material restrictions

The CMP Strasbaugh 6EC is designated as a Metals class tool. Below is a list of approved materials for the tool. Approved means the material is allowed in the tool under normal circumstances. If a material is not listed, please create a helpdesk ticket or email info@lnf.umich.edu for any material requests or questions.


This is NOT a CMOS process therefore metals are allowed. In general polymers or surfaces that are not attacked by the slurries available can't be polished. The CMP process is based on a chemical attack by the slurry that softens surface layer and subsequently gets removed by the action of the abrasive in the slurry an the pad. Therefore, diamond like materials, SiC, Teflon, or metals that are only dissolved in aqua regia cannot be polished.

Supported processes

There are several processes for this tool supported by the LNF, detailed in the table below. If you are curious if your material can be processed in this tool, please contact the tool engineers via the helpdesk ticket system.

Standard operating procedure

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Checkout procedure

  1. Talk with the Process Engineer if you are thinking of including this technique in your process, this is very important; there are many steps you should take at the mask design level that will make your life easier if you are planning to CMP
  2. Read through this page and the Standard Operating Procedure above.
  3. Complete the training request form here.
  4. Create a Helpdesk Ticket requesting training.
  5. A tool engineer will schedule a time for initial training.
  6. Practice with your mentor, if possible, or another authorized user until you are comfortable with tool operation.
  7. Schedule a checkout session with a tool engineer via the helpdesk ticket system. If this checkout is successful, the engineer will authorize you on the tool.

Maintenance

Periodic Maintenance is performed according to the Maintenance Schedule in the Strasbaugh 6EC Operation and Maintenance manual. User maintenance is limited to platen change to use different pads, and carrier film change if necessary. Users must be trained and checked out by tool engineers in order to perform these procedures! Damage to the tool can result from improper performance of these procedures!

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