Difference between revisions of "Category:PVD"

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(Replaced content with "{{main|Physical vapor deposition}} Category:Deposition")
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{{main|Physical vapor deposition}}
{{quote|text=Physical vapor deposition (PVD) describes a variety of vacuum deposition methods used to deposit thin films by the condensation of a vaporized form of the desired film material onto various workpiece surfaces (e.g., onto semiconductor wafers). The coating method involves purely physical processes such as high-temperature vacuum evaporation with subsequent condensation, or plasma sputter bombardment rather than involving a chemical reaction at the surface to be coated as in chemical vapor deposition.|source=[[wikipedia:Physical_vapor_deposition|Wikipedia]]}}

Latest revision as of 09:34, 31 July 2015

The main article for this category is Physical vapor deposition


This category has the following 2 subcategories, out of 2 total.


Pages in category "PVD"

The following 6 pages are in this category, out of 6 total.