Difference between revisions of "Category:PVD"

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{{quote|text=Physical vapor deposition (PVD) describes a variety of vacuum deposition methods used to deposit thin films by the condensation of a vaporized form of the desired film material onto various workpiece surfaces (e.g., onto semiconductor wafers). The coating method involves purely physical processes such as high-temperature vacuum evaporation with subsequent condensation, or plasma sputter bombardment rather than involving a chemical reaction at the surface to be coated as in chemical vapor deposition.|source=[[wikipedia:Physical_vapor_deposition|Wikipedia]]}}
 
{{quote|text=Physical vapor deposition (PVD) describes a variety of vacuum deposition methods used to deposit thin films by the condensation of a vaporized form of the desired film material onto various workpiece surfaces (e.g., onto semiconductor wafers). The coating method involves purely physical processes such as high-temperature vacuum evaporation with subsequent condensation, or plasma sputter bombardment rather than involving a chemical reaction at the surface to be coated as in chemical vapor deposition.|source=[[wikipedia:Physical_vapor_deposition|Wikipedia]]}}
  

Revision as of 15:32, 20 April 2015

Physical vapor deposition (PVD) describes a variety of vacuum deposition methods used to deposit thin films by the condensation of a vaporized form of the desired film material onto various workpiece surfaces (e.g., onto semiconductor wafers). The coating method involves purely physical processes such as high-temperature vacuum evaporation with subsequent condensation, or plasma sputter bombardment rather than involving a chemical reaction at the surface to be coated as in chemical vapor deposition.

Variants of PVD include

  • Electron Beam Deposition
  • Sputter Deposition

Subcategories

This category has the following 2 subcategories, out of 2 total.

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Pages in category "PVD"

The following 6 pages are in this category, out of 6 total.