Difference between revisions of "Category:PVD"

From LNF Wiki
Jump to navigation Jump to search
Line 4: Line 4:
'''Variants of PVD include'''
'''Variants of PVD include'''
*Electron Beam Deposition
*{{Electron Beam Deposition|Electron Beam Deposition}}
*Sputter Deposition
*{{Sputter Deposition|Sputter Deposition}}

Revision as of 15:43, 20 April 2015

Physical vapor deposition (PVD) describes a variety of vacuum deposition methods used to deposit thin films by the condensation of a vaporized form of the desired film material onto various workpiece surfaces (e.g., onto semiconductor wafers). The coating method involves purely physical processes such as high-temperature vacuum evaporation with subsequent condensation, or plasma sputter bombardment rather than involving a chemical reaction at the surface to be coated as in chemical vapor deposition.

Variants of PVD include


This category has the following 2 subcategories, out of 2 total.


Pages in category "PVD"

The following 6 pages are in this category, out of 6 total.