Difference between revisions of "Category:PVD"
Jump to navigation
Jump to search
| Line 4: | Line 4: | ||
'''Variants of PVD include''' | '''Variants of PVD include''' | ||
| − | * | + | *[[Electron Beam Deposition|Electron Beam Deposition]] |
| + | |||
*{{Sputter Deposition|Sputter Deposition}} | *{{Sputter Deposition|Sputter Deposition}} | ||
Revision as of 15:44, 20 April 2015
Physical vapor deposition (PVD) describes a variety of vacuum deposition methods used to deposit thin films by the condensation of a vaporized form of the desired film material onto various workpiece surfaces (e.g., onto semiconductor wafers). The coating method involves purely physical processes such as high-temperature vacuum evaporation with subsequent condensation, or plasma sputter bombardment rather than involving a chemical reaction at the surface to be coated as in chemical vapor deposition.
Variants of PVD include
Subcategories
This category has the following 2 subcategories, out of 2 total.
P
Pages in category "PVD"
The following 6 pages are in this category, out of 6 total.
