Difference between revisions of "Category:PVD"

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'''Variants of PVD include'''
'''Variants of PVD include'''
*Electron beam physical vapor deposition
*Electron Beam Deposition
*Sputter Deposition
*Sputter Deposition

Revision as of 13:39, 14 November 2014

Physical vapor deposition (PVD) describes a variety of vacuum deposition methods used to deposit thin films by the condensation of a vaporized form of the desired film material onto various workpiece surfaces (e.g., onto semiconductor wafers). The coating method involves purely physical processes such as high-temperature vacuum evaporation with subsequent condensation, or plasma sputter bombardment rather than involving a chemical reaction at the surface to be coated as in chemical vapor deposition.

Variants of PVD include

  • Electron Beam Deposition
  • Sputter Deposition


This category has the following 2 subcategories, out of 2 total.


Pages in category "PVD"

The following 6 pages are in this category, out of 6 total.