Contrast Enhancement Material (CEM)

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Contrast enhancement is a microlithography technique which extends the practical limits of optical lithography systems. This improvement in resolution, depth of focus and reduced interference, allows the fabrication of new and denser integrated circuits without the required capital equipment investment

Processes

CEM is used on conjunction with photo resist to enhance it ability to resolve fine features.

  • Do your normal photo resist process through soft bake.
  • Apply CEM 365iS at the CEE 100 spinner (use recipe #4)
    • Spread for 5 seconds at 500rpm
    • Spin at 4000 rpm for 30 seconds
    • The film will remain somewhat tacky so it is not well suited to contact alignment.
  • Expose your sample
    • Exposure times will need to be increased 10-30% from your standard resist exposure time
  • Rinse your sample in water to remove CEM material
    • ACS has a "DI Rinse 30 seconds" recipe
  • Proceed with lithography as normal

Process SOPs

  • There are currently no process SOPs defined for this chemical.

Equipment

Technical Data Sheet

Safety Data Sheet

References

  • Other links that are useful