Difference between revisions of "Deep UV SenLights PL16"

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===Substrate requirements===
===Substrate requirements===
* Pieces to a 150mm wafer, up to ~5cm thick
* Pieces to a 150mm wafer, up to 70mm thick
===Material restrictions===
===Material restrictions===

Revision as of 12:17, 14 October 2019

Deep UV SenLights PL16
Equipment Details
Manufacturer SenLights
Model PL16
Technology Lithography
Materials Restriction Metals
Material Processed Photoresist
Sample Size pieces up to a 6" wafer
Gases Used ozone
Equipment Manual
Overview [??? System Overview]
Operating Procedure [??? SOP]
Supported Processes [??? Supported Processes]

Warning Warning: This page is under construction (Oct 2019)

The SenLights PL16 is a Deep UV exposure tool that can be used for ozone cleaning, hard-baking photoresist, and surface treatments.


  • Surface cleaning via ozone
  • Polymer etching va ozone
  • Positive photoresist (novolac based) crosslinking
  • PDMS Surface Modification
  • Surface prep for low temp fusion bonding

System overview

Hardware details

  • Aprox. 15 mW/cm2 at 30mm of 254nm light
  • 185nm light for ozone generation
  • Low concentrations of ozone in the range of 20-200ppm

Substrate requirements

  • Pieces to a 150mm wafer, up to 70mm thick

Material restrictions

The Deep UV SenLights PL16 is designated as a Metals class tool. Below is a list of approved materials for the tool. Approved means the material is allowed in the tool under normal circumstances. If a material is not listed, please create a helpdesk ticket or email info@lnf.umich.edu for any material requests or questions.

Standard operating procedure

Widget text will go here.

Checkout procedure

  1. Read through this page and the Standard Operating Procedure above.
  2. Complete the SOP quiz
  3. Create a Helpdesk Ticket requesting checkout.


The etch rate of a 100mm Si wafer coated with SPR 955 is monitored on a aprox. biweekly basis.