Difference between revisions of "Deep UV SenLights PL16"

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* After developing SPR 955 run for 5min with 1cm gap
* After developing SPR 955 run for 5min with 1cm gap
* Bake at 180C for 30 min
* Bake at 180C for 30 min
[http:// Fully Cross-linking SPR 955]  
==Checkout procedure==
==Checkout procedure==

Revision as of 12:05, 4 December 2019

Deep UV SenLights PL16
Equipment Details
Manufacturer SenLights
Model PL16
Technology Lithography
Materials Restriction General
Material Processed Photoresist
Sample Size pieces up to a 6" wafer
Gases Used ozone
Equipment Manual
Operating Procedure Equipment Manual

Warning Warning: This page is under construction (Oct 2019)

The SenLights PL16 is a Deep UV exposure tool that can be used for ozone cleaning, hard-baking photoresist, and surface treatments.


  • Surface cleaning via ozone
  • Polymer etching va ozone
  • Positive photoresist (novolac based) crosslinking
  • PDMS Surface Modification
  • Surface prep for low temp fusion bonding

System overview

Hardware details

  • Aprox. 15 mW/cm2 at 30mm of 254nm light
  • 185nm light for ozone generation
  • Low concentrations of ozone in the range of 20-200ppm

Substrate requirements

  • Pieces to a 150mm wafer, up to 70mm thick

Material restrictions

The Deep UV SenLights PL16 is designated as a General class tool. Below is a list of approved materials for the tool. Approved means the material is allowed in the tool under normal circumstances. If a material is not listed, please create a helpdesk ticket or email info@lnf.umich.edu for any material requests or questions.

Equipment Manual

Equipment Manual

Process Info

Etch Rate

This is an isotropic etch that's highly dependent on localized loading. Small isolated features can etch around 2-4X faster then a blanket film.

  • 100mm wafer of blanket SPR 955: ~100 nm/hr

Etch Rate Overview

Improve Wet Etch Undercut

  • After developing SPR 955 run for 5min with 1cm gap.

[http:// BHF Undercut Overview]

Fully cross-link SPR 955

  • After developing SPR 955 run for 5min with 1cm gap
  • Bake at 180C for 30 min

SPR 955 Litho Cure Litho.jpeg SPR 955 Litho Cure Litho 2.jpeg

Checkout procedure

  1. Read through this page and the Equipment Manual
  2. Complete the SOP quiz
  3. Create a Helpdesk Ticket requesting checkout.


The etch rate of a 100mm Si wafer coated with SPR 955 is monitored on an approximately biweekly basis.