Difference between revisions of "Deep UV SenLights PL16"
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* After developing SPR 955 run for 5min with 1cm gap | * After developing SPR 955 run for 5min with 1cm gap | ||
* Bake at 180C for 30 min | * Bake at 180C for 30 min | ||
| − | [ | + | [[File:SPR_955_Litho_Cure_Litho.jpeg|500px|frameless]] |
| + | [[File:SPR_955_Litho_Cure_Litho_2.jpeg|500px|frameless]] | ||
==Checkout procedure== | ==Checkout procedure== | ||
Revision as of 12:05, 4 December 2019
| Deep UV SenLights PL16 | |
|---|---|
 | |
| Equipment Details | |
| Manufacturer | SenLights |
| Model | PL16 |
| Technology | Lithography |
| Materials Restriction | General |
| Material Processed | Photoresist |
| Sample Size | pieces up to a 6" wafer |
| Gases Used | ozone |
| Equipment Manual | |
| Operating Procedure | Equipment Manual |
Warning: This page is under construction (Oct 2019)
The SenLights PL16 is a Deep UV exposure tool that can be used for ozone cleaning, hard-baking photoresist, and surface treatments.
Contents
Capabilities
- Surface cleaning via ozone
- Polymer etching va ozone
- Positive photoresist (novolac based) crosslinking
- PDMS Surface Modification
- Surface prep for low temp fusion bonding
System overview
Hardware details
- Aprox. 15 mW/cm2 at 30mm of 254nm light
- 185nm light for ozone generation
- Low concentrations of ozone in the range of 20-200ppm
Substrate requirements
- Pieces to a 150mm wafer, up to 70mm thick
Material restrictions
The Deep UV SenLights PL16 is designated as a General class tool. Below is a list of approved materials for the tool. Approved means the material is allowed in the tool under normal circumstances. If a material is not listed, please create a helpdesk ticket or email info@lnf.umich.edu for any material requests or questions.
Equipment Manual
Process Info
Etch Rate
This is an isotropic etch that's highly dependent on localized loading. Small isolated features can etch around 2-4X faster then a blanket film.
- 100mm wafer of blanket SPR 955: ~100 nm/hr
Improve Wet Etch Undercut
- After developing SPR 955 run for 5min with 1cm gap.
[http:// BHF Undercut Overview]
Fully cross-link SPR 955
- After developing SPR 955 run for 5min with 1cm gap
- Bake at 180C for 30 min
Checkout procedure
- Read through this page and the Equipment Manual
- Complete the SOP quiz
- Create a Helpdesk Ticket requesting checkout.
Qualification
The etch rate of a 100mm Si wafer coated with SPR 955 is monitored on an approximately biweekly basis.
