Deep UV SenLights PL16
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| Deep UV SenLights PL16 | |
|---|---|
| Equipment Details | |
| Manufacturer | SenLights |
| Model | 310TA (E) |
| Technology | Lithography |
| Materials Restriction | Metals |
| Material Processed | Photoresist |
| Sample Size | pieces up to a 6" wafer |
| Gases Used | Ozone |
| Equipment Manual | |
| Overview | [??? System Overview] |
| Operating Procedure | [??? SOP] |
| Supported Processes | [??? Supported Processes] |
The SenLights DUV PL16 is a DUV exposure tool that can be used for ozone cleaning and hardbaking photoresist. It has a variable height stage that can accommodate up to 6" wafers
Contents
Capabilities
System overview
Hardware details
- Aprox. 15 mW/cm2 at 30mm of 254nm light
- 185nm light for ozone generation
- Low concentrations of ozone in the range of 20-200ppm
Substrate requirements
- Pieces to a 150mm wafer, up to ~5cm thick
Material restrictions
The Deep UV SenLights PL16 is designated as a Metals class tool. Below is a list of approved materials for the tool. Approved means the material is allowed in the tool under normal circumstances. If a material is not listed, please create a helpdesk ticket or email info@lnf.umich.edu for any material requests or questions.
Approved materials
Supported processes
- Surface cleaning via ozone
- Polymer etching va ozone
- Positive photoresist (novolac based) crosslinking
Standard operating procedure
Widget text will go here.
Checkout procedure
- Read through this page and the Standard Operating Procedure above.
- Complete the SOP quiz
- Create a Helpdesk Ticket requesting checkout.
Qualification
The etch rate of a 100mm Si wafer coated with SPR 955 is monitored on a aprox. biweekly basis.
