Deep UV SenLights PL16

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Deep UV SenLights PL16
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Equipment Details
Manufacturer SenLights
Model PL16
Technology Lithography
Materials Restriction Metals
Material Processed Photoresist
Sample Size pieces up to a 6" wafer
Gases Used ozone
Equipment Manual
Operating Procedure SOP
Supported Processes [??? Supported Processes]


Warning Warning: This page is under construction (Oct 2019)


The SenLights PL16 is a Deep UV exposure tool that can be used for ozone cleaning, hard-baking photoresist, and surface treatments.


Capabilities

  • Surface cleaning via ozone
  • Polymer etching va ozone
  • Positive photoresist (novolac based) crosslinking
  • PDMS Surface Modification
  • Surface prep for low temp fusion bonding

System overview

Hardware details

  • Aprox. 15 mW/cm2 at 30mm of 254nm light
  • 185nm light for ozone generation
  • Low concentrations of ozone in the range of 20-200ppm

Substrate requirements

  • Pieces to a 150mm wafer, up to 70mm thick

Material restrictions

The Deep UV SenLights PL16 is designated as a Metals class tool. Below is a list of approved materials for the tool. Approved means the material is allowed in the tool under normal circumstances. If a material is not listed, please create a helpdesk ticket or email info@lnf.umich.edu for any material requests or questions.



Equipment Manual

Equipment Manual

Checkout procedure

  1. Read through this page and the Equipment Manual
  2. Complete the SOP quiz
  3. Create a Helpdesk Ticket requesting checkout.


Qualification

The etch rate of a 100mm Si wafer coated with SPR 955 is monitored on a aprox. biweekly basis.