Denton Explorer-14
Denton Explorer-14 | |
---|---|
Equipment Details | |
Technology | PVD |
Materials Restriction | Metals |
Material Processed | Ti, Ir |
Sample Size | Stage holds 100mm, and smaller samples |
Equipment Manual | |
Overview | System Overview |
Operating Procedure | SOP |
Supported Processes | Supported Processes |
User Processes | User Processes |
Maintenance | Maintenance |
The Denton Explorer-14 is a magnetron sputter deposition tool for depositing conductive metallic films. Sputter deposition is achieved by bombarding a source material with energetic ions, typically Ar+. Atoms at the surface of the target are knocked loose, and transported to the surface of the substrate, where deposition occurs. Electrically conductive material such as Al, W, and Ti can use a dc power source, in which the target acts as the cathode in a diode system. Sputtering of dielectrics such as silicon dioxide, or aluminum oxide requires an Rf power source to supply energy to the argon atoms. Sputter films are ideal for sidewall coverage in low thermal budget cases for contact and insulating layers over features.
Contents
Announcements
- Due to the unavailability of the Lab 18's the Denton will be acquiring some new material.
- The target configuration has been moved to the Supported Process section below. Follow the link to Denton Explorer-14/Processes. On that page under the Target Calendar header is the link to the calendar.
Capabilities
- Computer controlled recipes
- limited film stress versatility with in film development.
- LN2 supported process chamber evacuation
System Overview
The Denton Explorer-14 has a 14" D-shaped chamber with LN2 supported pumping to reach high vacuum in the process chamber. The tools two magnetron sputtering sources are set up to allow for DC sputtering of Iridium and Titanium Films.
Hardware Details
- Turbo pumped chamber – upper 10-7 base pressure
- Chamber capacity: single wafer
- Power specs
- Two 3” Sputtering Guns
- 2 DC power supplies
Substrate Requirements
- Sample sizes: pieces, up to 4” wafers.
- Diameter 100mm maximum
- Substrates thickness may impact the deposition rate of the film.
Material Restrictions
The Denton Explorer-14 is designated as a Metals class tool. Below is a list of approved materials for the tool. Approved means the material is allowed in the tool under normal circumstances. If a material is not listed, please create a helpdesk ticket or email info@lnf.umich.edu for any material requests or questions.
Supported Processes
This section requires expansion. |
Basic "User" access with the Denton Explorer-14 provide researchers the ability to load, transfer samples, and deposit standard characterized materials. For more details, see Denton Explorer-14/Processes.
In addition to these, this tool has a number of user-supported recipes for depositing a wide variety of materials. Some of these recipes are documented on [Lab 18-1 User Processes]. If you are curious if your material can be deposited in this tool, please contact the tool engineers via the helpdesk ticket system.
Process Name
Two films are available in this tool. If two thicknesses are listed the first is for per run and the second thickness is for total material used per reservation.
Material | Max thickness (Run/Reservation) | |
---|---|---|
Iridium (Ir) | 2000 Å / NA | |
Titanium (Ti) | 2000 Å / 5000 Å |
Standard Operating Procedure
Widget text will go here.
Checkout Procedure
The Denton Explorer-14 is on the LNF Scheduler. LNF constituents may reserve time on the tool, and even request staff support for process development.
- Read through the Standard Operating Procedure above.
- Create a helpdesk ticket requesting training.
- A tool engineer will schedule a time for initial training.
- Practice with your mentor or another authorized user until you are comfortable with tool operation.
- Schedule a checkout session with a tool engineer via the helpdesk ticket system. If this checkout is successful, the engineer will authorize you on the tool.
Maintenance
For more details, see Denton Explorer-14/Maintenance and qualification.