Difference between revisions of "Deposition"

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==Technologies==
 
==Technologies==
Typical technologies include physical vapor deposition (PVD), chemical vapor deposition (CVD), electrochemical deposition (ECD), molecular beam epitaxy (MBE) and more recently, atomic layer deposition (ALD) among others.
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Typical technologies include physical vapor deposition (PVD), chemical vapor deposition (CVD), electrodeposition/ electroplating or electrochemical deposition (ECD), and atomic layer deposition (ALD).
  
 
===Physical vapor deposition (PVD)===
 
===Physical vapor deposition (PVD)===
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===Electrodeposition/ Electroplating/ Electrochemical deposition (ECD)===
 
===Electrodeposition/ Electroplating/ Electrochemical deposition (ECD)===
 
[https://en.wikipedia.org/wiki/Electroplating Electrodeposition]  
 
[https://en.wikipedia.org/wiki/Electroplating Electrodeposition]  
 
===Molecular beam epitaxy (MBE)===
 
[https://en.wikipedia.org/wiki/Molecular_beam_epitaxy Molecular beam epitaxy (MBE)]
 
  
 
===Atomic layer deposition (ALD)===
 
===Atomic layer deposition (ALD)===

Revision as of 16:06, 22 September 2015

Deposition is any process that grows, coats, or otherwise transfers a material onto the substrate.

Technologies

Typical technologies include physical vapor deposition (PVD), chemical vapor deposition (CVD), electrodeposition/ electroplating or electrochemical deposition (ECD), and atomic layer deposition (ALD).

Physical vapor deposition (PVD)

Physical vapor deposition (PVD) describes a variety of vacuum deposition methods used to deposit thin films by the condensation of a vaporized form of the desired film material onto various substrates.

Chemical vapor deposition (CVD)

Chemical vapor deposition (CVD) consists of the substrate being exposed to one or more volatile precursors, which react and/or decompose on the substrate surface to produce the desired deposit. There are many methods for enhancing the chemical reaction rates of the precursors.

Electrodeposition/ Electroplating/ Electrochemical deposition (ECD)

Electrodeposition

Atomic layer deposition (ALD)

Atomic Layer Deposition (ALD) at the LNF is performed on the Oxford OpAL ALD system that currently offers three films Alumina/Aluminum Oxide (Al2O3), Hafnia/Hafnium Oxide (HfO2), and Zinc Oxide (ZnO).


Figures of merit

Deposition rate

Refractive index

Stress

Thermal budget