Difference between revisions of "Deposition"
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Chemical vapor deposition (CVD) consists of the substrate being exposed to one or more volatile precursors, which react and/or decompose on the substrate surface to produce the desired deposit. There are many methods for enhancing the chemical reaction rates of the precursors. | Chemical vapor deposition (CVD) consists of the substrate being exposed to one or more volatile precursors, which react and/or decompose on the substrate surface to produce the desired deposit. There are many methods for enhancing the chemical reaction rates of the precursors. | ||
| − | ===Electrochemical deposition (ECD)=== | + | ===Electrodeposition/ Electroplating/ Electrochemical deposition (ECD)=== |
| − | + | [https://en.wikipedia.org/wiki/Electroplating Electrodeposition] | |
===Molecular beam epitaxy (MBE)=== | ===Molecular beam epitaxy (MBE)=== | ||
| − | + | [https://en.wikipedia.org/wiki/Molecular_beam_epitaxy Molecular beam epitaxy (MBE)] | |
===Atomic layer deposition (ALD)=== | ===Atomic layer deposition (ALD)=== | ||
| − | [https://en.wikipedia.org/wiki/Atomic_layer_deposition Atomic Layer Deposition (ALD)] | + | [https://en.wikipedia.org/wiki/Atomic_layer_deposition Atomic Layer Deposition (ALD)] at the LNF is performed on the Oxford OpAL ALD system that currently offers three films Alumina/Aluminum Oxide ([[Al2O3|Al<sub>2</sub>O<sub>3</sub>]]), Hafnia/Hafnium Oxide ([[HfO2|HfO<sub>2</sub>]]), and Zinc Oxide ([[ZnO|ZnO]]). |
Revision as of 16:02, 22 September 2015
Deposition is any process that grows, coats, or otherwise transfers a material onto the substrate.
Contents
Technologies
Typical technologies include physical vapor deposition (PVD), chemical vapor deposition (CVD), electrochemical deposition (ECD), molecular beam epitaxy (MBE) and more recently, atomic layer deposition (ALD) among others.
Physical vapor deposition (PVD)
Physical vapor deposition (PVD) describes a variety of vacuum deposition methods used to deposit thin films by the condensation of a vaporized form of the desired film material onto various substrates.
Chemical vapor deposition (CVD)
Chemical vapor deposition (CVD) consists of the substrate being exposed to one or more volatile precursors, which react and/or decompose on the substrate surface to produce the desired deposit. There are many methods for enhancing the chemical reaction rates of the precursors.
Electrodeposition/ Electroplating/ Electrochemical deposition (ECD)
Molecular beam epitaxy (MBE)
Atomic layer deposition (ALD)
Atomic Layer Deposition (ALD) at the LNF is performed on the Oxford OpAL ALD system that currently offers three films Alumina/Aluminum Oxide (Al2O3), Hafnia/Hafnium Oxide (HfO2), and Zinc Oxide (ZnO).
