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Deposition is any process that grows, coats, or otherwise transfers a material onto the substrate.


Typical technologies include atomic layer deposition (ALD), chemical vapor deposition (CVD), electrodeposition/ electroplating or electrochemical deposition (ECD), and physical vapor deposition (PVD).

Atomic layer deposition (ALD)

Atomic Layer Deposition (ALD) at the LNF is performed on the Oxford OpAL ALD system that currently offers three films Alumina/Aluminum Oxide (Al2O3), Hafnia/Hafnium Oxide (HfO2), and Zinc Oxide (ZnO).

Chemical vapor deposition (CVD)

Chemical vapor deposition (CVD) consists of the substrate being exposed to one or more volatile precursors, which react and/or decompose on the substrate surface to produce the desired deposit. There are many methods for enhancing the chemical reaction rates of the precursors. The LNF has fourteen Low Pressure CVD (LPCVD) furnace tubes and five Plasma Enhanced CVD (PECVD) chambers.

Electrodeposition/ Electroplating/ Electrochemical deposition (ECD)


`===Physical vapor deposition (PVD)=== Physical vapor deposition (PVD) describes a variety of vacuum deposition methods used to deposit thin films by the condensation of a vaporized form of the desired film material onto various substrates.

Figures of merit

Deposition rate

Refractive index


Thermal budget

Wet Etch Rate (WER)