E-Beam Spinner/Hot-Plate Bench 21

E-Beam Spinner Hot-Plate Bench 21
Equipment Details
Technology	Wet chemical processing
Materials Restriction	Metals
Material Processed	PMMA, ZEP, HSQ, E-Spacer, aquaSAVE
Sample Size	10 mm X 10 mm piece parts to 4" wafers
Equipment Manual
Overview	System Overview
Operating Procedure	SOP
Supported Processes	Supported Processes
User Processes	User Processes
Maintenance	Maintenance

The E-Beam Spinner Hot-Plate Bench 21 is a fully programmable, manual dispense, e-beam resist spinner located in 1480A. It can accept 10 mm X 10 mm pieces to 4" wafers.

Announcements

• The E-Beam Spinner/Hot-Plate Bench 21 is online

Capabilities

Available e-beam resists: PMMA, ZEP

For all other resists, please contact staff to request approval

System overview

Hardware details

• Up to 6K rpm spin rates
• Hot plate preset at 180°C
• Photoresist is dispensed manually

Substrate requirements

• 10 mm x 10 mm pieces up to 4" wafers
• No substrate material requirements
• Available Chucks
  • 4" Chuck (Ø 2.25")
  • Large Piece Chuck (Ø 0.75")
  • Small Piece Chuck (Ø 0.25" - chuck ; Ø 0.375" - O-ring)

Material restrictions

Approved resists

1. PMMA
2. ZEP
3. HSQ

Water soluble conductive polymers such as E-Spacer and aquaSAVE can be used at this bench

Supported processes

Listed below are the Film Thicknesses vs spin Speed for commonly used e-beam resists at LNF

Standard operating procedure

Widget text will go here.

Checkout procedure

1. Read through this page and the Standard Operating Procedure above.
2. Create a Helpdesk Ticket requesting training.
3. A tool engineer will schedule a time for training and checkout.

Maintenance

Once a week during lab clean the E-Beam Spinner/Hot-Plate Bench 21 is cleaned and the spinner bowl liner is checked/ replaced if necessary