Difference between revisions of "EVG 510"

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{{cleanup-manual|The SOP still needs a lot of work.}}
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{{#vardefine:toolid|140031}}{{#vardefine:technology|Wafer bonding}}{{#vardefine:restriction|3}}
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<!-- Set the resource ID, 5 digit # found on the scheduler -->
 
{{#vardefine:toolid|140031}}
 
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{{#vardefine:technology|Wafer bonding}}
 
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{{infobox equipment
 
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|caption =  
 
|caption =  
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|maintenance = [https://docs.google.com/document/d/1AJMewlQGrYUMI_lpq5ffChDiakoJaBTVrq7AXBCRJpQ/preview Maintenance]
 
|maintenance = [https://docs.google.com/document/d/1AJMewlQGrYUMI_lpq5ffChDiakoJaBTVrq7AXBCRJpQ/preview Maintenance]
 
}}
 
}}
 
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The [[{{PAGENAME}}]] is a [[Wafer bonding|wafer bonder]] capable of bonding pieces up to 150 mm wafers.  It is primarily used for polymer bonding and wafer mounting with [[Waferbond|WaferBOND]], but can also be used for other other types of bonding.  Generally the [[EVG 520IS]] should be used for non-polymer bonding since the chamber is less contaminated with  as the chamber does not allow polymers making the tool cleaner.  Also the [[CL200 Megasonic Cleaner]] can be used before bonding to reduce particulate.
{{warning|This page has not been released yet.}}
 
 
 
<!-- Insert the tool description here -->
 
The EVG 510 is a wafer bonder capable of bonding pieces up to 150 mm wafers.  It is primarily used for polymer bonding and wafer mounting with [[Waferbond|WaferBOND]], but can also be used for other other types of bonding.  Generally the [[EVG 520IS]] should be used for non-polymer bonding since the chamber is less continamted with  as the chamber does not allow polymers making the tool cleaner.  Also the [[CL200 Megasonic Cleaner]] can be used before bonding to reduce particulate.
 
  
 
==Announcements==
 
==Announcements==
* None at this time
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===Pressure Plate Schedule===
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Unless otherwise specified, the default pressure plate will be installed in the tool. For all other pressure plate change requests, please submit a helpdesk ticket at least 2 business days in advance. If there are existing reservations to use the scheduled plate, those will take precedence.
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* Default: '''4" Ti'''
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{{note|Users are not authorized to change pressure plates.|reminder}}
  
 
==Capabilities==
 
==Capabilities==
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** Anodic
 
** Anodic
 
** Eutectic
 
** Eutectic
* Wafer Mounting via [[Waferbond|WaferBOND]]
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* Wafer mounting via [[Waferbond|WaferBOND]]
  
 
==System Overview==
 
==System Overview==
 
===Hardware Details===
 
===Hardware Details===
 
* Force
 
* Force
** 0 to 10 kN
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** 0.1 to 10 kN
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** '''Maximum pressure: 3.8 MPa''' (dependent on hardware and bonding method)
 
* Vacuum
 
* Vacuum
 
** 1e-5 mBar
 
** 1e-5 mBar
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===Material Restrictions===
 
===Material Restrictions===
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{{note|The approved materials listed for the {{PAGENAME}} are restricted to those that can come into surface with the tooling. There are several exceptions that are allowed within the bond interface, depending on the type of bond used. Some of these can be found in the [[#supported processes]] section. For any other materials, please create a helpdesk ticket. }}
 
{{material restrictions}}
 
{{material restrictions}}
  
 
==Supported Processes==  
 
==Supported Processes==  
 
<!-- We recommend creating a subpage detailing the supported processes for the tool, which will be generated if you leave the link below. Alternatively, you may include the information on this page. In that case, the Supported Processes document from the equipment manual can be included here, using {{#widget:GoogleDoc|key=googledocid}} -->
 
<!-- We recommend creating a subpage detailing the supported processes for the tool, which will be generated if you leave the link below. Alternatively, you may include the information on this page. In that case, the Supported Processes document from the equipment manual can be included here, using {{#widget:GoogleDoc|key=googledocid}} -->
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There are currently no characterized processes for the tool. 
  
There are several processes for this tool supported by the LNF, which are described in more detail on the [[/Processes/]] page.
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{{:{{PAGENAME}}/Processes}}
  
 
==Standard Operating Procedure==
 
==Standard Operating Procedure==

Revision as of 18:21, 25 March 2021

EVG 510
140031.jpg
Equipment Details
Technology Wafer bonding
Materials Restriction Metals
Material Processed Si, Glass
Sample Size pieces, 100 mm, 150 mm
Equipment Manual
Overview System Overview
Operating Procedure SOP
Supported Processes Processes
Maintenance Maintenance


The EVG 510 is a wafer bonder capable of bonding pieces up to 150 mm wafers. It is primarily used for polymer bonding and wafer mounting with WaferBOND, but can also be used for other other types of bonding. Generally the EVG 520IS should be used for non-polymer bonding since the chamber is less contaminated with as the chamber does not allow polymers making the tool cleaner. Also the CL200 Megasonic Cleaner can be used before bonding to reduce particulate.

Announcements

Pressure Plate Schedule

Unless otherwise specified, the default pressure plate will be installed in the tool. For all other pressure plate change requests, please submit a helpdesk ticket at least 2 business days in advance. If there are existing reservations to use the scheduled plate, those will take precedence.

  • Default: 4" Ti
Users are not authorized to change pressure plates.

Capabilities

  • Bonding
    • Polymer
    • Anodic
    • Eutectic
  • Wafer mounting via WaferBOND

System Overview

Hardware Details

  • Force
    • 0.1 to 10 kN
    • Maximum pressure: 3.8 MPa (dependent on hardware and bonding method)
  • Vacuum
    • 1e-5 mBar
    • ACP 28G Backing pump with Turbo
  • Temperature
    • 20°C to 550°C
    • 45°C/min heating rate
    • Passive cooling (1°C/min)
  • Voltage
    • ± 2000 V
    • Up to 50 mA

Substrate Requirements

  • Pieces, 100 mm, 150 mm

Material Restrictions

The approved materials listed for the EVG 510 are restricted to those that can come into surface with the tooling. There are several exceptions that are allowed within the bond interface, depending on the type of bond used. Some of these can be found in the #supported processes section. For any other materials, please create a helpdesk ticket.

The EVG 510 is designated as a Metals class tool. Below is a list of approved materials for the tool. Approved means the material is allowed in the tool under normal circumstances. If a material is not listed, please create a helpdesk ticket or email info@lnf.umich.edu for any material requests or questions.


Supported Processes

There are currently no characterized processes for the tool.

Maximum force

Bonding processes are characterized by a required pressure (force per area) in order to achieve bonding. The tool recipe specifies a force (in Newtons). This value should be scaled depending on the sample size to achieve the desired pressure. In addition, there is a maximum pressure that may be applied without damaging the equipment, which is dependent on the tooling material and whether the temperature is constant or varying while applying force.

The force value in the recipe should NEVER exceed the maximum force/pressure for the tool conditions. Users will be responsible for any damage caused to equipment if these guidelines are not followed.

The maximum pressure for the tooling available is shown in the following table. To calculate the force (in N), multiply the pressure (in MPa) by the sample area (in mm2).

Pressure Disk Material Pressure (MPa)
Steady state While heating
Ti 3.8 0.5
Quartz 0.6 0.2

Several common sample sizes are shown below. Note that small pieces cannot be used with the quartz plate, because they are below the minimum pressure that the tool can apply (100 N).

Pressure Disk Material Force (kN)
150 mm wafer 100 mm wafer 50 mm wafer 10x10 mm piece
Steady state While heating Steady state While heating Steady state While heating Steady state While heating
Ti 10 8 10 4 7.5 1 0.4 N/A
Quartz 10 5 5 2 1.25 0.5 N/A N/A

Standard Operating Procedure

Widget text will go here.

Checkout Procedure

  1. Read through this page and the Standard Operating Procedure above.
  2. Create a Helpdesk Ticket requesting training.
  3. A tool engineer will schedule a time for initial training.
  4. Practice with your mentor or another authorized user until you are comfortable with tool operation.
  5. Complete the SOP quiz here.
  6. Schedule a checkout session with a tool engineer via the helpdesk ticket system. If this checkout is successful, the engineer will authorize you on the tool.

Maintenance

Once a week the chucks are cleaned and inspected for damage. A monitor run is performed every other month on a 150 mm wafer to ensure that the tool is in good operating condition.