EVG 510

EVG 510
Equipment Details
Technology	Wafer bonding
Materials Restriction	Metals
Material Processed	Si, Glass
Sample Size	pieces, 100 mm, 150 mm
Equipment Manual
Overview	System Overview
Operating Procedure	SOP
Supported Processes	Processes
Maintenance	Maintenance

The EVG 510 is a wafer bonder capable of bonding pieces up to 150 mm wafers. It is primarily used for polymer bonding and wafer mounting with WaferBOND, but can also be used for other other types of bonding. Generally the EVG 520IS should be used for non-polymer bonding since the chamber is less contaminated with as the chamber does not allow polymers making the tool cleaner. Also the CL200 Megasonic Cleaner can be used before bonding to reduce particulate.

Announcements

Pressure Plate Schedule

Unless otherwise specified, the default pressure plate will be installed in the tool. For all other pressure plate change requests, please submit a helpdesk ticket at least 2 business days in advance. If there are existing reservations to use the scheduled plate, those will take precedence.

• Default: 4" Ti

Users are not authorized to change pressure plates.

Capabilities

• Bonding
  • Polymer
  • Anodic
  • Eutectic
• Wafer mounting via WaferBOND

System Overview

Hardware Details

• Force
  • 0.1 to 10 kN
  • Maximum pressure 3.8 MPa depending on hardware
• Vacuum
  • 1e-5 mBar
  • ACP 28G Backing pump with Turbo
• Temperature
  • 20°C to 550°C
  • 45°C/min heating rate
  • Passive cooling (1°C/min)
• Voltage
  • ± 2000 V
  • Up to 50 mA

Substrate Requirements

• Pieces, 100 mm, 150 mm

Material Restrictions

The approved materials listed for the EVG 510 are restricted to those that can come into surface with the tooling. There are several exceptions that are allowed within the bond interface, depending on the type of bond used. Some of these can be found in the #supported processes section. For any other materials, please create a helpdesk ticket.

The EVG 510 is designated as a Metals class tool. Below is a list of approved materials for the tool. Approved means the material is allowed in the tool under normal circumstances. If a material is not listed, please create a helpdesk ticket or email info@lnf.umich.edu for any material requests or questions.

Approved materials

Supported Processes

The supported processes for this tool are described in detail in the supported processes document. For a specific process the maximum chuck force should not exceed the guidelines below.

Pressure Disk Material	Force (kN)
	150 mm		100 mm		75 mm		50 mm
	Steady State	While Heating	Steady State	While Heating	Steady State	While Heating	Steady State	While Heating
Ti	10	8	10	4	1.5	1.5	6	1
Quartz	10	5	5	2	3	1	2	0.5

Standard Operating Procedure

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Checkout Procedure

1. Read through this page and the Standard Operating Procedure above.
2. Create a Helpdesk Ticket requesting training.
3. A tool engineer will schedule a time for initial training.
4. Practice with your mentor or another authorized user until you are comfortable with tool operation.
5. Complete the SOP quiz here.
6. Schedule a checkout session with a tool engineer via the helpdesk ticket system. If this checkout is successful, the engineer will authorize you on the tool.

Maintenance

Once a week the chucks are cleaned and inspected for damage. A monitor run is performed every other month on a 150 mm wafer to ensure that the tool is in good operating condition.