EVG 510

EVG 510
Equipment Details
Technology	Wafer Bonding
Materials Restriction	Metals
Material Processed	Si, Glass
Sample Size	pieces, 100 mm, 150 mm
Equipment Manual
Overview	System Overview
Operating Procedure	SOP
Supported Processes	Processes
Maintenance	Maintenance

Warning:

This page has not been released yet.

The EVG 510 is a wafer bonder capable of bonding pieces up to 150 mm wafers. It is primarily used for polymer bonding and wafer mounting with WaferBOND, but can also be used for other other types of bonding. Generally the EVG 520 LS should be used for non-polymer bonding since the chamber is less continamted with as the chamber does not allow polymers making the tool cleaner.

Announcements

• None at this time

Capabilities

• Bonding
  • Polymer
  • Anodic
  • Eutectic
• Wafer Mounting via WaferBOND

System Overview

Hardware Details

• Force
  • 0 to 10 kN
• Vacuum
  • 1e-5 mBar
  • ACP 28G Backing pump with Turbo
• Temperature
  • 20°C to 550°C
  • 45°C/min heating rate
  • Passive cooling (1°C/min)
• Voltage
  • ± 2000 V
  • Up to 50 mA

Substrate Requirements

• Pieces, 100 mm, 150 mm

Material Restrictions

The EVG 510 is designated as a Metals class tool. Below is a list of approved materials for the tool. Approved means the material is allowed in the tool under normal circumstances. If a material is not listed, please create a helpdesk ticket or email info@lnf.umich.edu for any material requests or questions.

Approved materials

Supported Processes

There are several processes for this tool supported by the LNF, which are described in more detail on the Processes page.

In addition to these, this tool has a number of user-created recipes for etching a wide variety of materials. Some of these recipes are documented on EVG 510 User Processes. If you are curious if your material can be processed in this tool, please contact the tool engineers via the helpdesk ticket system.

Standard Operating Procedure

Widget text will go here.

Checkout Procedure

1. Read through this page and the Standard Operating Procedure above.
2. Complete the training request form here.
3. Create a Helpdesk Ticket requesting training.
4. A tool engineer will schedule a time for initial training.
5. Practice with your mentor or another authorized user until you are comfortable with tool operation.
6. Complete the SOP quiz here.
7. Schedule a checkout session with a tool engineer via the helpdesk ticket system. If this checkout is successful, the engineer will authorize you on the tool.

Maintenance

Once a week the chucks are cleaned and inspected for damage. A monitor run is performed every XXXX on a 150 mm wafer XXX